Abstract
The need to replace current technological materials by lightweight, easily processible and cheaper substances has been reflected in active research toward the modification of polymer characteristics. One of the more prominent demonstrations has been the enhancement of electrical conduction in polyacetylenes and related polymers by addition of either donor or acceptor species. These doped materials suffer, however in stability for most routine applications; consequently their use will probably be limited to “hermetically sealed” systems.2 Our laboratory has also been interested in lowering polymer electrical resistance. Limiting ourselves to polyimides, we have achieved to varying degrees air stable electrical conduction.3 This achievement, however, has been restricted to films with additives that showed migration of metal to the surfaces of these doped films during thermal imidization. The formation of a metal(0) layer during thermal imidization in air or the interaction of a surface metal species with moisture have been rationalized to account for the lowered resistivity. The quest for additives that will enhance conduction through the bulk of the polymer rather than on the polymer surface remains challenging.
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© 1985 Plenum Press, New York
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Khor, E., Taylor, L.T. (1985). A Study of Cobalt Containing Polyimide Films. In: Sheats, J.E., Carraher, C.E., Pittman, C.U. (eds) Metal-Containing Polymeric Systems. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-9415-4_21
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DOI: https://doi.org/10.1007/978-1-4615-9415-4_21
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