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The Applicability of Fracture Mechanics Technology to Porcelain Ceramics

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Fracture Mechanics of Ceramics

Abstract

An experimental investigation was conducted to evaluate the applicability of existing linear elastic fracture mechanics technology to multiphase electrical porcelain ceramics. The effect of test specimen geometry, crack length and notch radius on the nominal fracture toughness of electrical porcelain ceramic was evaluated and a KIc testing procedure developed. Results show that fracture mechanics technology can be used to develop realistic component design, material selection and nondestructive inspection criteria for ceramic materials. A hypothetical example problem is included and the application of fracture mechanics technology to a ceramic structure is demonstrated.

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References

  1. Irwin, G. R., “Fracture Mechanics,” Structural Mechanics, Pergamon Press, New York and London, 1960.

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Author information

Authors and Affiliations

  1. Westinghouse Research Laboratories, Pittsburgh, Pennsylvania, USA

    W. G. Clark Jr. & W. A. Logsdon

Authors
  1. W. G. Clark Jr.
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  2. W. A. Logsdon
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Editor information

Editors and Affiliations

  1. Department of Materials Science, Ceramics Science Section, Pennsylvania State University, University Park, Pennsylvania, USA

    R. C. Bradt

  2. Ceramics Research Laboratory, Materials Research Center, Lehigh University, Bethlehem, Pennsylvania, USA

    D. P. H. Hasselman

  3. Research and Development Center, Westinghouse Electric Corporation, Pittsburgh, Pennsylvania, USA

    F. F. Lange

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© 1974 Plenum Press, New York

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Clark, W.G., Logsdon, W.A. (1974). The Applicability of Fracture Mechanics Technology to Porcelain Ceramics. In: Bradt, R.C., Hasselman, D.P.H., Lange, F.F. (eds) Fracture Mechanics of Ceramics. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-7014-1_26

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  • DOI: https://doi.org/10.1007/978-1-4615-7014-1_26

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4615-7016-5

  • Online ISBN: 978-1-4615-7014-1

  • eBook Packages: Springer Book Archive

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