Abstract
Chemical reactions involving SF6 and various dielectric gas mixtures were studied quantitatively in low-power arc discharges. the concentrations of SF6 mixed with the following fluorocarbons: CHF3, CF4, C2F6, C3F6, 2-C4F6 and c-C4F8 were varied in the range of 0 to 100%. Dielectric mixtures using CHF3 and CF4 were found much more stable under electrical stresses than the ones containing unsaturated fluorocarbon molecules which shown the highest rates of decomposition. CF4 and SOF2 were the two major reaction byproducts observed. Many more sulfur-containing fluorocarbon compounds were identified in the byproducts: C2F2S2, C2F4S2, C2F6S, C2F6S2, in addition to S2F2(two different isomers found), S3F2 and CS2. Finally, the dilution (at 50 and 75%) of a dielectric gas mixture with nitrogen resulted in an important reduction of the decomposition rates, larger than the dilution factor.
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Castonguay, J. (1998). Chemical Reactions and Kinetics of Mixtures of SF6 and Fluorocarbon Dielectric Gases in Electrical Discharges. In: Christophorou, L.G., Olthoff, J.K. (eds) Gaseous Dielectrics VIII. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-4899-7_53
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DOI: https://doi.org/10.1007/978-1-4615-4899-7_53
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