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Asymptotic Waveform Evaluation

And Moment Matching for Interconnect Analysis

  • Book
  • © 1994

Overview

Authors:
  1. Eli Chiprout

    1. Carleton University, Canada

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    You can also search for this author in PubMed   Google Scholar

  2. Michel S. Nakhla

    1. Carleton University, Canada

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    You can also search for this author in PubMed   Google Scholar

Part of the book series: The Springer International Series in Engineering and Computer Science (SECS, volume 252)

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Table of contents (9 chapters)

  1. Front Matter

    Pages i-xvi
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  2. Introduction

    • Eli Chiprout, Michel S. Nakhla
    Pages 1-13

  3. Asymptotic waveform Evaluation

    • Eli Chiprout, Michel S. Nakhla
    Pages 15-39

  4. Transmission Lines

    • Eli Chiprout, Michel S. Nakhla
    Pages 41-65

  5. Padé Approximations

    • Eli Chiprout, Michel S. Nakhla
    Pages 67-84

  6. Accuracy Improvements

    • Eli Chiprout, Michel S. Nakhla
    Pages 85-102

  7. Complex Frequency Hopping

    • Eli Chiprout, Michel S. Nakhla
    Pages 103-127

  8. Nonlinear Analysis

    • Eli Chiprout, Michel S. Nakhla
    Pages 129-150

  9. Sensitivity Analysis

    • Eli Chiprout, Michel S. Nakhla
    Pages 151-167

  10. Other Applications

    • Eli Chiprout, Michel S. Nakhla
    Pages 169-178

  11. Back Matter

    Pages 179-197
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Keywords

About this book

The intense drive for signal integrity has been at the forefront ofrapid and new developments in CAD algorithms. Thousands ofengineers, intent on achieving the best design possible, use SPICE on a daily basis for analog simulation and general circuit analysis. But the strained demand for high data speeds, coupled with miniaturizationon an unprecedented scale, has highlighted the previously negligible effects of interconnects; effects which are not always handled appro­ priately by the present levels of SPICE. Signals at these higher speeds may be degraded by long interconnect lengths compared to the increasingly shorter sig­ nal rise times. Interconnect structures can be diverse (pins, connectors, leads, microstrips, striplines, etc. ) and present at any of the hierarchical packaging levels: integrated circuits, printed circuit boards, multi-chip modules or sys­ tem backplanes. Analysis of these effects in any CAD package has become a necessity. Asymptotic waveform evaluation (AWE) and other moment matching tech­ niques have recently proven useful in the analysis of interconnect structures and various networks containing large linear structures with nonlinear termi­ nations. Previously, all that was available to the designer was a full SPICE simulation or a quick but uncertain timing estimation. Moment matching, used in linear systems analysis as a method of model reduction, describes a method to extract a small set of dominant poles from a large network. The information is obtained from the Taylor series coefficients (moments) of that system.

Authors and Affiliations

  • Carleton University, Canada

    Eli Chiprout, Michel S. Nakhla

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