Abstract
The overall objectives of this study were to evaluate the performance of solvents and cleaning devices for removing particles from silicon wafers, determine the limitations of wet cleaning practices used in today’s semiconductor industry and suggest improvements based upon fundamental measurements of particle adhesion to surfaces. Specifically, the cleaning efficiencies of selected solvents were measured in an ultrasonic force field for particulate contaminants of well-defined sizes and properties. The influence of wafer surface properties on particle removal and the merits of the ultrasonic cleaning system were also investigated. Polar solvents such as water and ethanol-acetone (1:1 mixture) were found to be far more superior than the Freons in removing particles of widely differing compositions. Also, the force required to clean wafers with surface oxide layers was observed to be lower than that for bare silicon wafers.
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© 1989 Plenum Press, New York
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Menon, V.B., Michaels, L.D., Donovan, R.P., Debler, V.L., Ranade, M.B. (1989). Particle Removal from Semiconductor Wafers Using Cleaning Solvents. In: Mittal, K.L. (eds) Particles in Gases and Liquids 1. Springer, Boston, MA. https://doi.org/10.1007/978-1-4613-0793-8_17
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DOI: https://doi.org/10.1007/978-1-4613-0793-8_17
Publisher Name: Springer, Boston, MA
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