Skip to main content
Log in

Hierarchically designed sticky thermoelectric materials to fabricate thinner Peltier sheets and device architectures

  • Original Paper
  • Published:
MRS Advances Aims and scope Submit manuscript

Abstract

The market of Peltier devices has been growing in the healthcare, automotive, and sensor industries, yet the cooling performance has been constrained because of their rigidity, small area size, and low cooling capacity. Physically speaking, thinner Peltier sheets could solve these long-known issues because of sheet’s enhanced flexibility enabling to attach on various surfaces, larger cooling area for the same amount of thermoelectric (TE) materials used, and better device cooling capacity. To build the thinner Peltier sheet, we enclosed the deformable hierarchically designed sticky TE materials within the punched holes of 0.5-mm thickness middle layer using the upper and bottom electrode layers. We obtained the flexibility as bending φ 20 mm, 5-times less weight per area, and Peltier effect as the temperature differences over 4 °C between the upper and bottom. This paper suggests the hierarchically designed sticky TE materials pave a way to develop and mass-produce thinner Peltier sheets.

Graphical abstract

This is a preview of subscription content, log in via an institution to check access.

Access this article

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Fig. 1
Fig. 2
Fig. 3

Similar content being viewed by others

Data availability

The data generated during the current study are available from the corresponding author on reasonable request.

References

  1. https://www.transparencymarketresearch.com/thermoelectric-modules-market.html. Accessed 28 February 2023

  2. H.J. Goldsmid, CRC handbook of thermoelectrics (CRC Press, 1995), pp.19–26

    Google Scholar 

  3. I. Chowdhury, R. Prasher, K. Lofgreen, G. Chrysler, S. Narasimhan, R. Mahajan, D. Koester, R. Alley, R. Venkatasubramanian, On-chip cooling by superlattice-based thin-film thermoelectrics. Nat. Nanotechnol. 4, 235–238 (2009)

    Article  CAS  Google Scholar 

  4. Y. Yu, W. Zhu, X. Kong, Y. Wang, P. Zhu, Y. Deng, Recent development and application of thin-film thermoelectric cooler. Front. Chem. Sci. Eng. 14, 492–503 (2020)

    Article  CAS  Google Scholar 

  5. L.M. Goncalves, J.G. Rocha, C. Couto, P. Alpuim, G. Min, D.M. Rowe, J.H. Correia, Fabrication of flexible thermoelectric microcoolers using planar thin-film technologies. J. Micromech. Microeng. 17, S168 (2007)

    Article  CAS  Google Scholar 

  6. N. Satoh, M. Otsuka, J. Kawakita, T. Mori, A hierarchical design for thermoelectric hybrid materials: Bi2Te3 particles covered by partial Au skins enhance thermoelectric performance in sticky thermoelectric materials. Soft Sci. 2, 15 (2022)

    Article  Google Scholar 

  7. N. Satoh, M. Otsuka, T. Ohki, A. Ohi, Y. Sakurai, Y. Yamashita, T. Mori, Organic π-type thermoelectric module supported by photolithographic mold: a working hypothesis of sticky thermoelectric materials. Sci. Technol. Adv. Mater. 19, 517–525 (2018)

    Article  CAS  Google Scholar 

  8. N. Satoh, M. Otsuka, Y. Sakurai, T. Asami, Y. Goto, T. Kawamori, T. Masaki, G. Yatabe, J. Kawakita, T. Mori, Sticky thermoelectric materials for flexible thermoelectric modules to capture low–temperature waste heat. MRS Adv. 5, 481–487 (2020)

    Article  CAS  Google Scholar 

  9. N. Satoh, J.-S. Cho, M. Higuchi, K. Yamamoto, Novel triarylamine dendrimers as a hole-transport material with a controlled metal-assembling function. J. Am. Chem. Soc. 125, 8104–8105 (2003)

    Article  CAS  Google Scholar 

  10. N. Satoh, T. Nakashima, K. Yamamoto, Metal-assembling dendrimers with a triarylamine core and their application to a dye-sensitized solar cell. J. Am. Chem. Soc. 127, 13030–13038 (2005)

    Article  CAS  Google Scholar 

  11. N. Satoh, L. Han, Chemical input and I–V output: stepwise chemical information processing in dye-sensitized solar cells. Phys. Chem. Chem. Phys. 14, 16014–16022 (2012)

    Article  CAS  Google Scholar 

  12. https://espressomilkcooler.com/wp-content/uploads/2015/03/TEC1-12706-site-ready.pdf. Accessed 28 February 2023

  13. F.D. Rosi, B. Abeles, R.V. Jensen, Materials for thermoelectric refrigeration. J. Phys. Chem. Solids 10, 191–200 (1959)

    Article  CAS  Google Scholar 

Download references

Funding

This study was funded by New Energy and Industrial Technology Development Organization (NEDO), JPNP20004, Norifusa SATOH, and Council for Science, Technology and Innovation (CSTI), Public/Private R&D Investment Strategic Expansion PrograM (PRISM), Jin Kawakita.

Author information

Authors and Affiliations

Authors

Corresponding author

Correspondence to Norifusa Satoh.

Ethics declarations

Conflict of interest

On behalf of all authors, the corresponding author states that there is no conflict of interest.

Additional information

Publisher's Note

Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.

Rights and permissions

Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law.

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Satoh, N., Otsuka, M. & Kawakita, J. Hierarchically designed sticky thermoelectric materials to fabricate thinner Peltier sheets and device architectures. MRS Advances 8, 446–450 (2023). https://doi.org/10.1557/s43580-023-00541-1

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1557/s43580-023-00541-1

Navigation