Filler-matrix thermal boundary resistance of diamond-copper composite with high thermal conductivity

Abstract

A composite material with a high thermal conductivity is obtained by capillary infiltration of copper into a bed of diamond particles of 400 μm size, the particles having been pre-coated with tungsten. The measured thermal conductivity of the composite decreases from 910 to 480 W m⁻¹ K⁻¹ when the coating thickness is increased from 110 to 470 nm. Calculations of the filler/matrix thermal boundary resistance R and the thermal conductivity of the coating layer λ _i using differential effective medium, Lichtenecker’s and Hashin’s models give similar numerical values of R and λ _i ≈ 1.5 W m⁻¹ K⁻¹. The minimal thickness of the coating h ∼ 100 nm necessary for ensuring production of a composite while maximizing its thermal conductivity, is of the same order as the free path of the heat carriers in diamond (phonons) and in copper (electrons). The heat conductance of the diamond/tungsten carbide coating/copper interface when h is of this thickness is estimated as (0.8–1) × 10⁸ W m⁻² K⁻¹ and is at the upper level of values characteristic for perfect dielectric/metal boundaries.