Abstract
We study the growth of Cu films en route to the production of CuInSe2 thin films as absorber layers in solar cells by a low pressure chemical vapor deposition technique. In order to obtain good quality films, the deposition conditions such as substrate, source temperatures, concentration ratio of Ar to H2 have been optimized. The surface morphology and structural analysis of Cu films have been carried out. It is revealed that annealing resulted in a change in the properties of the films and also in the generation of other phases such as γ-Cu5Si (cubic) and CuO (monoclinic). ©1999Kluwer Academic Publishers
This is a preview of subscription content, log in via an institution to check access.
Similar content being viewed by others
References
Y. Arita, E. Yamamoto, M. Sato and K. Ikeda, NTT Rev. 9 (1997) 88.
J. O. Carlsson, CRC Crit. Rev. Solid State Mater. Sci. 16 (1990) 161.
“Solid State Electronic Devices”, edited by B. G. Streetman, (Prentice Hall of India Private Ltd., New Delhi, 1997) p. 100.
B. G. Demczyk, R. Naik, G. Auner, C. Kota and U. Rao, J.Appl.Phys. 75 (1994) 1956.
C. S. Liu and L. J. Chen, ibid. 74 (1993) 5501.
M. Kowuma and K. Uosaki, Electrochim.Acta 40 (1995) 1345.
B. Zheng, G. Braeckelmann, K. Kujawski, I. Lou, S. Lane and A. E. Kaloyers, J.Electrochem.Soc. 142 (1995) 3896.
Y. D. Chen, A. Reisman, I. Turlik and D. Temple, J.Electrochem.Soc. 142 (1995) 3911.
S. Duchemin, M. C. Artaud, F. Ouchen, J. Bougnot and A. M. Pougnet, J.Mater.Sci., Mater.Electron. 7 (1996) 201.
A. E. Kaloyeros, B. Zheng, I. Lou, J. Lou, J. Lau and J. W. Hellgeth, Thin Solid Films 262 (1995) 20.
J. Y. Kim, H. A. Marzouk, P. J. Reucroft, C. C. Eloi and J. D. Robertson, J.Appl.Phys. 78 (1995) 245.
Y. Arita, N. Awaya, K. Ohno and M. Sato, MRS Bull 19 (1994) 68.
B. Lecohier, B. Calpini, J.-M. Philippoz, H. Van den berg, D. Laub and P. A. Buffat, J.Electrochem.Soc. 140 (1993) 789.
Y. D. Chen, A. Reisman, I. Turlik and D. Temple, ibid. 142 (1995) 3903.
P. A. Jones, Ph D thesis, University of Salford, Salford, UK, (1993).
N. Awaya and Y. Arita, J.Electron Mater. 21 (1992) 959.
T. H. Stumm and H. Van der bergh, Mater.Sci.Eng.B 23 (1994) 48.
ALDRICH, “Catalog Handbook of Fine Chemicals” (1992± 1993).
G. L. Griffin and A. W. Maverick, in “Chemical Aspects of Chemical Vapor Deposition for Metallization”, edited by T. T. kodas and M. J. hampden-smith, (VCH Publisher, New York, 1993).
S. R. Wenham and M. A. Green, Prog.Photovolt.Res.Appl. 4 (1996) 3.
D. H. Kim, R. H. Wentorf and W. N. Gill, J.Electrochem.Soc. 140 (1993) 3273.
D. Temple and Reisman, ibid. 136 (1989) 3525.
B. Lecohier, B. Calpini, J.-M. Phillippoz and VAN DER Bergh, J.Appl.Phys. 72 (1992) 2022.
M. J. Mouche, J. L. Mermet, M. Romand and M. Charbonnier, Thin Solid Films 262 (1995) 1.
D. N. Lee, J.Mater.Sci. 24 (1989) 4375.
C. Barret and T. B. Massalski, “Structure of Metals”, (Pergamon Press, Oxford, 1989).
G. A. Petersen, J. E. Parmeter, C. A. Apblett, M. F. Gonzales, P. M. Smith, T. R. Omstead and J. A. T. Norman, J.Electrochem.Soc. 142 (1995) 939.
B. D. Cullity, “Elements of X-ray diffraction” (Addison-Wesley Publishing Company, 1978) p. 284.
J. E. Parmeter, G. A. Petersen, P. M. Smith, C. A. Apblett, J. S. Reid, J. A. T. Norman, A. K. Hochberg and D. A. Roberts, J.Vac.Sci.Technol.B 13 (1995) 130.
S. K. Rha, W. J. Lee, S. Y. Lee, D. W. Kim, C. K. Park and S. S. Park CHEN, J.Mater.Res. 12 (1997) 3367.
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Ramaiah, K.S., Pilkington, R.D., Hill, A.E. et al. The growth of Cu thin films by low pressure chemical vapor deposition. Journal of Materials Science: Materials in Electronics 10, 51–57 (1999). https://doi.org/10.1023/A:1008979107614
Issue Date:
DOI: https://doi.org/10.1023/A:1008979107614