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Elektrovergussmassen und -systeme mit hoher Wärmeleitfähigkeit

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Literaturverzeichnis

  1. A. Griesinger: Wärmemanagement in der Elektronik. Springer, Heidelberg 2019

  2. F. Sarvar, D. C. Whalley and P. P. Conway: Thermal Interface Materials - A Review of the State of the Art. 1st Electronic Systemintegration Technology Conference, 2006, 1292-1302

  3. A. Maurer: Neue thermisch leitfähige Klebstoffe für kraft- und wärmeschlüssige Verbindungen. Dichtungstechnik Jahrbuch, Mannheim, 2016, 426-434

  4. Y. Lin, X. Huang, J. Chen, P. Jiang: Epoxy thermoset resins with high pristine thermal conductivity. High Volt., 2017, Vol. 2 Iss. 3, 139-146

  5. P. Chowdhury, K. Sikka, A. Grill, D. Parekh: Optimal Filler Sizes for Thermal Interface Materials. 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 2019, 52-57

  6. N. Tessier-Doyen et al.: Thermal conductivity of alumina inclusion/glass matrix composite materials: local and macroscopic scales. Journal of the European Ceramic Society 27 (2007), 2635-2640

  7. ISO 22007-2:2015: Plastics — Determination of thermal conductivity and thermal diffusivity — Part 2: Transient plane heat source (hot disc) method

  8. J. H. Conway, N. J. A. Sloane: Sphere Packings, Lattices and Groups. Springer, 1999

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Authors and Affiliations

  1. OST – Ostschweizer Fachhochschule, Buchs, Schweiz

    Arno Maurer &  Jens Ulmer

  2. Bucher Hydraulics AG, Romanshorn, Schweiz

    Alex Itten

  3. APM Technica AG, Heerbrugg, Schweiz

    Michael Ewart & Alex Huber

Authors
  1. Arno Maurer
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  2. Jens Ulmer
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  3. Alex Itten
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  4. Michael Ewart
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  5. Alex Huber
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Corresponding author

Correspondence to Arno Maurer.

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Maurer, A., Ulmer, J., Itten, A. et al. Elektrovergussmassen und -systeme mit hoher Wärmeleitfähigkeit. Adhaes Kleb Dicht 65, 18–21 (2021). https://doi.org/10.1007/s35145-021-0529-z

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  • DOI: https://doi.org/10.1007/s35145-021-0529-z

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