Abstract
The microstructural formation and properties of Sn-2.5Bi−xIn-1Zn-0.3Ag (in wt%) alloys and the evolution of soldered interfaces on a Cu substrate were investigated. Apart from the relatively low melting point (about 195°C), which is close to that of conventional eutectic Sn-Pb solder, the investigated solder presents superior wettability, solderability, and ductility. The refined equiaxial grains enhance the mechanical properties, and the embedded bulk intermetallic compounds (IMCs) (Cu6Sn5 and Cu5Zn8) and granular Bi particles improve the joint reliability. The addition of In reduces the solubility of Zn in the β-Sn matrix and strongly influences the separation and growth behaviors of the IMCs. The soldered interface of Sn-2.5Bi-xIn-1Zn-0.3Ag/Cu consists of Cu-Zn and Cu-Sn IMC layers.
This is a preview of subscription content, log in via an institution to check access.
Similar content being viewed by others
References
J. Shen and Y.C. Chan, Research advances in nano-composite solders, Microelectron. Reliab., 49(2009), No.3, p.223.
N. Chawla, Thermomechanical behaviour of environmentally benign Pb-free solders, Int. Mater. Rev., 54(2009), No.6, p.368.
M. Abtew and G. Selvaduray, Lead-free solders in microelectronics, Mater. Sci. Eng. R, 27(2000), No.5, p.95.
X. Wang, Y. Xiu, and M.J. Dong, and Y.C. Liu, The microstructure and properties of the Sn-xBi-0.9Zn-0.3Ag lead-free solders, J. Mater. Sci. Mater. Electron., 22(2011), No.6, p.592.
D.Q. Yu and L. Wang, The growth and roughness evolution of intermetallic compounds of Sn-Ag-Cu/Cu interface during soldering reaction, J. Alloys Compd., 458(2008), No.1, p.542.
G. Zeng, S.B. Xue, L.L. Zhang, L.L. Gao, W. Dai, and J.D. Luo, A review on the interfacial intermetallic compounds between Sn-Ag-Cu based solders and substrates, J. Mater. Sci. Mater. Electron., 21(2010), No.5, p.421.
L. Zhang, S.B. Xue, L.L. Gao, G. Zeng, Z. Sheng, Y. Chen, and S.L. Yu, Determination of Anand parameters for SnAg-CuCe solder, Modell. Simul. Mater. Sci. Eng., 17(2009), No.7, art. no.075014.
C. Wei, Y.C. Liu, Z.M. Gao, C.S. Ma, and J.B. Wan, Effects of small addition of In on the structure of the rapidly cooled Sn-Ag-Zn solder, J. Alloys Compd., 470(2009), No.1–2, p.145.
X. Wang, Y.C. Liu, C. Wei, L.M. Yu, Z.M. Gao, and Z.Z. Dong, Effects of composition and cooling rate on the microstructure of Sn-3.7Ag-0.9Zn-Bi solders, Appl. Phys. A, 96(2009), No.4, p.969.
X. Wang, Y.C. Liu, C. Wei, H.X. Gao, P. Jiang, and L.M. Yu, Strengthening mechanism of SiC-particulate reinforced Sn-3.7Ag-0.9Zn lead-free solder, J. Alloys Compd., 480(2009), No.2, p.662.
J.B. Wan, Y.C. Liu, C. Wei, Z.M. Gao, and C.S. Ma, Effect of Al content on the formation of intermetallic compounds in Sn-Ag-Zn lead-free solder, J. Mater. Sci. Mater. Electron., 19(2008), No.3, p.247.
J. Shen, Y.C. Liu, and H.X. Gao, In situ nanoparticulate-reinforced lead-free Sn-Ag composite prepared by rapid solidification, J. Mater. Sci. Mater. Electron., 18(2007), No.4, p.463.
X. Wang, Y.C. Liu, and Z.M. Gao. Effect of Bi content on spalling behavior of Sn-Bi-Zn-Ag/Cu interface, J. Mater. Sci. Mater. Electron., 22(2011), No.1, p.14.
Y.C. Liu, J.B. Wan, and Z.M. Gao, Intermediate decomposition of metastable Cu5Zn8 phase in the soldered Sn-Ag-Zn/ Cu interface, J. Alloys Compd., 465(2008), No.1-2, p.205.
R.L. Xu, Y.C. Liu, Y.J. Han, C. Wei, X. Wang, and L.M. Yu, The formation and evolution of intermetallic compounds formed between Sn-Ag-Zn-In lead-free solder and Ni/Cu substrate, J. Mater. Sci. Mater. Electron., 20(2009), No.7, p.675.
C. Wei, Y.C. Liu, and J.B. Wan, Formation of interfacial structure of Sn-3.7Ag-0.9Zn eutectic solder with different Al additions, J. Mater. Sci. Mater. Electron., 20(2009), No.9, p.861.
H.T. Lee, F.F. Lee, T.F. Hong, and H.W. Chen, Effect of In addition on Sn-Ag-Sb lead-free solder system, [in] 10th International Conference on Electronic Materials and Packaging, EMAP 2008, Taipei, 2008, p.191.
L.C. Tsao, S.Y. Chang, C.I. Lee, W.H. Sun, and C.H. Huang, Effects of nano-Al2O3 additions on microstructure development and hardness of Sn3.5Ag0.5Cu solder, Mater. Des., 31(2010), No.10, p.4831.
S.C. Yang, C.E. Ho, C.W. Chang, and C.R. Kao, Strong Zn concentration effect on the soldering reactions between Sn-based solders and Cu, J. Mater. Res., 21(2006), No.10, p.2436.
C.Y. Chou and S.W. Chen, Phase equilibria of the Sn-Zn-Cu ternary system, Acta Mater., 54(2006), No.9, p.2393.
T.C. Chang, J.W. Wang, M.C. Wang, and M.H. Hon, Solderability of Sn-9Zn-0.5Ag-1In lead-free solder on Cu substrate: Part 1. Thermal properties, microstructure, corrosion and oxidation resistance, J. Alloys Compd., 422(2006), No.1–2, p.239.
J.Y. Wang, C.F. Lin, and C.M. Chen, Retarding the Cu5Zn8 phase fracture at the Sn-9wt.% Zn/Cu interface, Scripta Mater., 64(2011), No.7, p.633.
T.C. Chang, Y.T. Hsu, M.H. Hon, and M.C. Wang, Enhancement of the wettability and solder joint reliability at the Sn-9Zn-0.5Ag lead-free solder alloy-Cu interface by Ag precoating, J. Alloys Compd., 360(2003), No.1–2, p.217.
W.F. Feng, C.Q. Wang, M. Morinaga, H. Yukawa, and Y. Liu, Electronic structure calculation for properties of Sn-based solder alloys with the relativistic DV-Xα method, Modell. Simul. Mater. Sci. Eng., 10(2002), No.2, p.121.
Author information
Authors and Affiliations
Corresponding author
Additional information
This work was financially supported by the National Natural Science Foundation of China (No.51077099) and Shanghai Baosteel Group Co. (No.50834011).
Rights and permissions
About this article
Cite this article
Dong, Mj., Gao, Zm., Liu, Yc. et al. Effect of indium addition on the microstructural formation and soldered interfaces of Sn-2.5Bi-1Zn-0.3Ag lead-free solder. Int J Miner Metall Mater 19, 1029–1035 (2012). https://doi.org/10.1007/s12613-012-0665-4
Received:
Revised:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s12613-012-0665-4