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Convective cooling and heat partitioning to grinding chips in high speed grinding of a nickel based superalloy

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Abstract

The level and variation of energy partition ratio to grinding chips in high speed grinding of a nickel based alloy has been investigated. The ratio to grinding chips is evaluated by relating the heat partitioning at the chip formation area with the whole thermal system, which is used to evaluate the convection heat transfer coefficient (CHTC) of water based grinding fluid. High level of CHTCs of the grinding fluid have been identified at high grinding speeds, beneficial heat transfer conditions of low ratios to the workpiece can be achieved. As the burnout happens with the CHTC dropping down to zero level, the ratio to the workpiece and grinding chips would become much higher, around 30–40 % of the grinding heat can be taken away by grinding chips. For nickel based superalloys, it is possible to achieve high material removal rates with the effective cooling of the grinding zone.

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Abbreviations

Vs :

Wheel speed

Vw :

Worktable speed

ap :

Depth of cut

Pt :

Grinding power

Ft :

The tangential grinding force

bs:

The grinding width

ae :

The grinding depth of cut

Q’w :

The material removal rate per unit grinding width

A and t:

Constants depending on the workpiece material and grinding conditions

Tmax :

The maximum grinding temperature rise

C:

C-factor in the circular moving heat source model

qw :

The heat flux to the workpiece

Ic :

Contact length between grinding wheel and workpiece

βw :

Thermal property of the workiece material

Rw :

Energy partition ratio to the workpiece

T0 :

Ambient temperature

hw :

A heat conduction factor

qt :

The total grinding heat flux

lc :

Wheel-work contact geometry

qw :

Grinding heat flux partitioned to the workpiece

qs :

Grinding heat flux partitioned to the grinding wheel

qf :

Grinding heat flux partitioned to grinding fluid

qch :

Grinding heat flux partitioned to grinding chips

Rws :

The heat partition ratio in the work-wheel subsystem

Rwch :

The heat partition ratio in the work-chip subsystem

hf :

The convection factor of grinding fluid

hch :

A heat conduction factor to grinding chips

Rf :

The heat partition to grinding fluid

Q’w :

Material removal rate

qt*:

The variation of critical burnout heat flux

T*:

The burnout threshold temperature

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Acknowledgments

The authors would like to acknowledge the support from the research project: study on grinding technology of high precision threads on KF7 cylindrical parts (K20164), AECC South Industry Company Ltd., 426X20200002.

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Authors and Affiliations

  1. National Engineering Research Center for High Efficiency Grinding, Hunan University, Changsha, Hunan, China

    Keli Peng, Feihong Lin, Tan Jin, Guizhi Xie & Zhentao Shang

  2. College of Mechanical and Vehicle Engineering, Hunan University, Changsha, Hunan, China

    Keli Peng, Feihong Lin, Tan Jin, Guizhi Xie & Zhentao Shang

  3. AECC South Industry Company Ltd., Zhuzhou, Hunan, China

    Pan Lu & Wencheng Bao

Authors
  1. Keli Peng
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  2. Pan Lu
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  6. Guizhi Xie
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  7. Zhentao Shang
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Correspondence to Zhentao Shang.

Additional information

Zhentao Shang is currently an Assistant Professor in the College of Mechanical and Vehicle Engineering at Hunan University, China. He received his Ph.D. degree in Mechanical Engineering from Hunan University in 2009. His research interests include conventional and high speed grinding technologies for difficult-to-machine materials and design of special grinding machine tools.

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Peng, K., Lu, P., Lin, F. et al. Convective cooling and heat partitioning to grinding chips in high speed grinding of a nickel based superalloy. J Mech Sci Technol 35, 2755–2767 (2021). https://doi.org/10.1007/s12206-021-0545-9

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  • DOI: https://doi.org/10.1007/s12206-021-0545-9

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