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In Situ TEM Observations of Cu6Sn5 Polymorphic Transformations in Reaction Layers Between Sn-0.7Cu Solders and Cu Substrates

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Abstract

Direct evidence of the relationship between the polymorphic phase transformation from monoclinic Cu6Sn5 to hexagonal Cu6Sn5 and stress accumulation/release in Cu6Sn5, formed at the interface between Sn-0.7Cu lead-free solder and their Cu substrates, has been obtained. To explore this challenging phenomenon, we developed an in situ heating/isothermal observation technique in ultrahigh-voltage transmission electron microscopy that enables the observation of thick samples (around 0.5 μm) for solder joints, including Cu/Cu3Sn/Cu6Sn5/Sn-0.7Cu solder interfaces prepared by a focused ion beam milling technique. The results show evidence of stress creation and release events by imaging bend contours that may arise due to the polymorphic transformations of the Cu6Sn5 phase and the associated volumetric change.

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Acknowledgements

This research was conducted under an international cooperative research program between the University of Queensland, Australia, Kyushu University, and Nihon Superior Company Ltd., Japan. K. Nogita was supported by the “UQ-KU Project”, which assists research collaborations between the University of Queensland and Kyushu University, during his visit at Kyushu University for high-voltage TEM experiments. PXRD experiments were performed at the Australian Synchrotron Powder Diffraction Beamline (AS132/PD/5784). The authors greatly thank Dr. Qinfen Gu of Australian Synchrotron for technical assistance.

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Authors and Affiliations

  1. Nihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM), School of Mechanical and Mining Engineering, The University of Queensland, St Lucia, Brisbane, QLD, 4072, Australia

    K. Nogita, M. A. A. Mohd Salleh, G. Zeng & S. D. McDonald

  2. Centre of Excellence Geopolymer and Green Technology, School of Materials Engineering, Universiti Malaysia Perlis (UniMAP), Taman Muhibbah, 02600, Jejawi, Arau, Perlis, Malaysia

    M. A. A. Mohd Salleh

  3. The Ultramicroscopy Research Center, Kyushu University, Fukuoka, 819-0395, Japan

    E. Tanaka & S. Matsumura

  4. Department of Applied Quantum Physics and Nuclear Engineering, Kyushu University, Fukuoka, 819-0395, Japan

    S. Matsumura

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  1. K. Nogita
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  2. M. A. A. Mohd Salleh
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  3. E. Tanaka
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  4. G. Zeng
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  5. S. D. McDonald
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  6. S. Matsumura
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Correspondence to K. Nogita.

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Nogita, K., Mohd Salleh, M.A.A., Tanaka, E. et al. In Situ TEM Observations of Cu6Sn5 Polymorphic Transformations in Reaction Layers Between Sn-0.7Cu Solders and Cu Substrates. JOM 68, 2871–2878 (2016). https://doi.org/10.1007/s11837-016-2020-0

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  • DOI: https://doi.org/10.1007/s11837-016-2020-0

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