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Hot Mixing Behavior and Curing Process of Epoxy Asphalt

  • Cementitious Materials
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Abstract

A new hot mixed epoxy asphalt system was developed. The reaction process of epoxy resin was characterized by Fourier transform infrared spectroscopy (FTIR). The viscosity was investigated by Brinell viscometer when epoxy resin was mixed with asphalt. The glass transition temperature (Tg), homogeneity, thermal stability and viscoelasticity of epoxy asphalt were analyzed by differential scanning calorimetry (DSC), metallographic microscope, thermogravimetric (TG) and dynamic mechanical analysis (DMA). The results showed that the viscosity of epoxy resin modified asphalt reached 1 000 mPa·s for more than 180 minutes at 180 °C, while the best construction process is mixing at 180 °C for 2 hours and curing at 60 °C for 4 days. The particle size of asphalt is less than 50 µm. In addition, the mechanical properties of the materials are uniform within the specified pavement thickness.

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Authors and Affiliations

  1. School of Materials Science and Engineering, Wuhan University of Technology, Wuhan, 430070, China

    Huawei Li  (李华伟), Wei Wei, Chao Zhang, Feifan Xu, Xin Li, Peng Jing & Quanyao Zhu  (朱泉峣)

  2. State Key Laboratory of Silicate Engineering Center, Wuhan University of Technology, Wuhan, 430070, China

    Qingjun Ding & Boxiang Yan

  3. Department of Physics, Changji University, Changji, 831100, China

    Wei Wei

Authors
  1. Huawei Li  (李华伟)
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  2. Wei Wei
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  3. Chao Zhang
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  4. Feifan Xu
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  5. Xin Li
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  6. Peng Jing
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  7. Quanyao Zhu  (朱泉峣)
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  8. Qingjun Ding
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  9. Boxiang Yan
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Corresponding author

Correspondence to Quanyao Zhu  (朱泉峣).

Additional information

Funded by the Fundamental Research Funds for the Central Universities (No. 195201039), and National Science Foundation of China (Nos. 51472189 and 51373129)

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Li, H., Wei, W., Zhang, C. et al. Hot Mixing Behavior and Curing Process of Epoxy Asphalt. J. Wuhan Univ. Technol.-Mat. Sci. Edit. 35, 605–610 (2020). https://doi.org/10.1007/s11595-020-2297-2

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  • DOI: https://doi.org/10.1007/s11595-020-2297-2

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