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Study on the Heat Dissipation Model and Simulation of Circular Element for DC-Link Capacitor

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The Proceedings of 2023 International Conference on Wireless Power Transfer (ICWPT2023) (ICWPT 2023)

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Abstract

With the continuous expansion of the application range of self-healing dry metallized film capacitor, its heat dissipation mode and internal temperature-rising have become important theoretical and engineering problems. In view of this, the paper is based on the heating rule of the cylindrical element of the DC-link capacitor. Furthermore, combined with the principle of electro-thermal duality, the thermal calculation model of the cylindrical element is established, and the thermal resistance calculation formula of a cylindrical element is obtained through the integration of the differential cells. Finally, the correctness of the thermal calculation model of cylindrical element is verified through the test, and the verification method of thermal calculation of cylindrical element is proposed, which will provide theoretical and experimental reference for the heating of cylindrical element of DC-link capacitor.

Foundation Project: Supported by National Key Research and Development Program (2021YFB2401504).

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Correspondence to Qiaoshu Lei .

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Zuo, Q., Lei, Q., Zhong, S., Zhang, Y., Dang, Z. (2024). Study on the Heat Dissipation Model and Simulation of Circular Element for DC-Link Capacitor. In: Cai, C., Qu, X., Mai, R., Zhang, P., Chai, W., Wu, S. (eds) The Proceedings of 2023 International Conference on Wireless Power Transfer (ICWPT2023). ICWPT 2023. Lecture Notes in Electrical Engineering, vol 1161. Springer, Singapore. https://doi.org/10.1007/978-981-97-0869-7_65

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  • DOI: https://doi.org/10.1007/978-981-97-0869-7_65

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  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-97-0868-0

  • Online ISBN: 978-981-97-0869-7

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