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Study on Temperature Field of MVA Capacity High Temperature Superconducting Transformer

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The Proceedings of the 9th Frontier Academic Forum of Electrical Engineering

Part of the book series: Lecture Notes in Electrical Engineering ((LNEE,volume 743))

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Abstract

It is very important to study the temperature rise of High Temperature Superconducting (HTS) transformer winding in short circuit. In this paper, the distribution of magnetic field and temperature field of MVA three-phase HTS transformer with high current carrying capacity is studied. Based on the finite element meth-od, the magnetic field distribution and AC loss of two-dimensional single-phase pan-cake winding model and cylinder winding model of HTS transformer are calculated respectively. Combined with the thermal parameters of liquid nitrogen and superconducting tape, the temperature field of two models is simulated and analyzed by finite element method. Based on the error analysis results caused by two-dimensional modeling, the electromagnetic field and temperature field distribution of high and low-voltage windings of HTS transformer under the condition of primary side short-circuit are calculated by using appropriate three-dimensional model of HTS transformer. The simulation results show that the heat dissipation performance of superconducting transformer is better than that of conventional transformer, which provides a theoretical basis for the design of HTS transformer.

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Acknowledgements

This work was supported in part by the China National Key Research and Development Projects under Grant (2018YFB0905801) and the National Natural Science Foundation of China under Grant (51707142 and 52077161).

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Correspondence to Nana Duan .

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Duan, N., Zhang, J., Wang, S. (2021). Study on Temperature Field of MVA Capacity High Temperature Superconducting Transformer. In: Chen, W., Yang, Q., Wang, L., Liu, D., Han, X., Meng, G. (eds) The Proceedings of the 9th Frontier Academic Forum of Electrical Engineering. Lecture Notes in Electrical Engineering, vol 743. Springer, Singapore. https://doi.org/10.1007/978-981-33-6609-1_55

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  • DOI: https://doi.org/10.1007/978-981-33-6609-1_55

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  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-33-6608-4

  • Online ISBN: 978-981-33-6609-1

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