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2.5D IC Integration

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Semiconductor Advanced Packaging

Abstract

The 2.5D IC integration defined by the electronic semiconductor industry as chips are supported by a passive TSV (through-silicon via) interposer.

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    John H. Lau

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Lau, J.H. (2021). 2.5D IC Integration. In: Semiconductor Advanced Packaging. Springer, Singapore. https://doi.org/10.1007/978-981-16-1376-0_6

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