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Fan-In Wafer/Panel-Level Chip-Scale Packages

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Semiconductor Advanced Packaging

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Abstract

First of all, as the name “fan-in wafer/panel-level chip-scale packages” indicates that packages are fabricated on a wafer or panel.

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    John H. Lau

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Lau, J.H. (2021). Fan-In Wafer/Panel-Level Chip-Scale Packages. In: Semiconductor Advanced Packaging. Springer, Singapore. https://doi.org/10.1007/978-981-16-1376-0_3

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