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Preparation and Thermal Storage Performance of Paraffin Phase Change Microcapsule Ink

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Advances in Graphic Communication, Printing and Packaging Technology and Materials

Part of the book series: Lecture Notes in Electrical Engineering ((LNEE,volume 754))

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Abstract

Phase change microcapsule refers to embedding phase change material as core material in the polymer wall material, and the latent heat possessed by the phase change material can be used to store and release. Meanwhile, phase change inks can be obtained by combining the microcapsules with inks in a certain proportion. In this study, phase change microcapsules with paraffin as the core material and melamine-formaldehyde resin as the wall material were synthesized by in-situ polymerization. The structure and performance of phase change microcapsules were characterized by differential scanning calorimetry and scanning electron microscope. At the same time, the phase change inks were obtained by formulating phase change microcapsules, binders, colorants and other materials at a certain ratio, and the printability of microcapsule inks was studied. The results show that the phase change microcapsules have good heat storage performance, and the phase change inks can be transferred to the surfaces of different flexible substrates by screen printing process. Finally, the functional printed products with phase change thermal insulation and patterning effects were obtained.

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Acknowledgements

This work was supported by the National Natural Science Foundation of China (21776021, 61971049), the Key Scientific Research Project of Beijing Municipal commission of Education (KZ201910015016, KZ202010015024), the BIGC Key Project (Ec202004, Ec201801), and the Cross training Plan for High Level Talents in Beijing.

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Correspondence to Zhicheng Sun .

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Li, F., Sun, Z., Zhang, Q., Wen, J., Du, X., Liu, R. (2021). Preparation and Thermal Storage Performance of Paraffin Phase Change Microcapsule Ink. In: Zhao, P., Ye, Z., Xu, M., Yang, L., Zhang, L., Zhu, R. (eds) Advances in Graphic Communication, Printing and Packaging Technology and Materials. Lecture Notes in Electrical Engineering, vol 754. Springer, Singapore. https://doi.org/10.1007/978-981-16-0503-1_93

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  • DOI: https://doi.org/10.1007/978-981-16-0503-1_93

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  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-16-0502-4

  • Online ISBN: 978-981-16-0503-1

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