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Analysis of Influence of Multilayer Ceramic Capacitor Mounting Method on Circuit Board Vibration

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Vibration Engineering for a Sustainable Future

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Abstract

As multilayer ceramic capacitors (MLCCs) act like piezo-actuators, printed circuit board (PCB) such as solid-state drive (SSD) vibrates and radiates acoustic noise when input AC electric field’s frequency coincides with the resonance frequency of the PCB. To minimize PCB vibration, in this study, the effect of mounting condition of MLCC was analyzed. Finite element (FE) models of PCB and MLCC was constructed to simulate various mounting condition. Each FE model was verified with experiment in previous studies. First, the influence of solder height was analyzed. The vibration amplitude at the center point of PCB was increased as the solder height increased. Second, the influence of mounting direction and position of MLCC was analyzed. As the vibration level varies considerably with frequency, especially for resonant frequencies, three mode shapes were chosen as the reference mode shapes considering the wave propagation direction. Parametric study was performed by changing the mounting direction by 0 and 90 degree and mounting position within a 3 X 3 grid for each reference mode. Low vibration was observed when MLCCs were mounted at nodal point with orthogonal direction to wave propagation direction.

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References

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Authors and Affiliations

  1. Yonsei University, Seoul, South Korea

    Dongjoon Kim, Wheejae Kim, Joo Young Yoon, Eunho Lee & No-Cheol Park

Authors
  1. Dongjoon Kim
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  2. Wheejae Kim
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  3. Joo Young Yoon
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  4. Eunho Lee
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  5. No-Cheol Park
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Corresponding author

Correspondence to No-Cheol Park .

Editor information

Editors and Affiliations

  1. Centre for Audio, Acoustics and Vibration, Faculty of Engineering and IT, University of Technology Sydney, Sydney, Australia

    Sebastian Oberst

  2. Centre for Audio, Acoustics and Vibration, Faculty of Engineering and IT, University of Technology Sydney, Sydney, Australia

    Benjamin Halkon

  3. School of Mechanical and Mechatronic Engineering, Faculty of Engineering and IT, University of Technology Sydney, Sydney, Australia

    Jinchen Ji

  4. School of Mechanical and Mechatronic Engineering, Faculty of Engineering and IT, University of Technology Sydney, Sydney, Australia

    Terry Brown

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Kim, D., Kim, W., Yoon, J.Y., Lee, E., Park, NC. (2021). Analysis of Influence of Multilayer Ceramic Capacitor Mounting Method on Circuit Board Vibration. In: Oberst, S., Halkon, B., Ji, J., Brown, T. (eds) Vibration Engineering for a Sustainable Future. Springer, Cham. https://doi.org/10.1007/978-3-030-48153-7_18

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  • DOI: https://doi.org/10.1007/978-3-030-48153-7_18

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  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-030-48152-0

  • Online ISBN: 978-3-030-48153-7

  • eBook Packages: EngineeringEngineering (R0)

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