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Co-Bonding of Cured FRP Components and SMC by Compression Molding

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  • Thermoset-Overmolding
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Lightweight Design worldwide

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Thanks

The authors would like to thank the Laboratory of Manufacturing Engineering (LaFT) and the Institute of Materials Technology from the Helmut Schmidt University / University of the Federal armed Forces of Germany in Hamburg for providing support and for the excellent cooperation.

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Fette, M., Stöß, N. & Hentschel, M. Co-Bonding of Cured FRP Components and SMC by Compression Molding. Lightweight des worldw 10, 34–39 (2017). https://doi.org/10.1007/s41777-017-0023-3

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  • DOI: https://doi.org/10.1007/s41777-017-0023-3

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