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Quantitative analysis on air-dispensing parameters for manufacturing dome lenses of chip-on-board LED system

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Abstract

A COB(chip-on-board) LED(light emitting diode) system has advantages such as low cost and good heat dissipation. LED chips are bonded on PCB(printed circuit board) directly without packaging process in case of COB LED systems. Dome lenses made of polymeric resin are generally covered on the bonded LED chips by air dispensing for preventing mechanical damage and making white light. However, it is hard to control the shape of dome lenses precisely due to viscosity of the polymeric resin. We analyzed the relationship of the shape of dome lenses and experimental conditions of the air dispensing in this study. We introduced a new parameter, air pressure * dispensing time, whose physical meaning is impulse per unit area, and obtained much clear relationship of dispensing parameters and shape parameters of the dome lens. This relationship was similar to viscoelastic behavior. The aspect ratio (height over diameter) was increased as the new parameter increased, and was converged to a certain value. The maximum aspect ratio could be calculated by Young’s equation of contact angle.

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References

  1. Lawton, W. and Barrett, J., “Characterisation of Chip-on-Board and Flip Chip Packaging Technologies by Acoustic Microscopy,” Microelectronics Reliability, Vol. 36, No. 11, pp. 1803–1806, 1996.

    Article  Google Scholar 

  2. Wang, Z. P., Tan, Y. M., and Chua, K. M., “Board Level Reliability Assessment of Chip Scale Packages,” Microelectronics Reliability, Vol. 39, No. 9, pp. 1351–1356, 1999.

    Article  Google Scholar 

  3. Morrow, R. C., “Led Lighting in Horticulture,” HortScience, Vol. 43, No. 7, pp. 1947–1950, 2008.

    Google Scholar 

  4. Sim, J. K., Ashok, K., Ra, Y. H., Im, H. C., Baek, B. J., and Lee, C. R., “Characteristic Enhancement of White Led Lamp using Low Temperature Co-Fired Ceramic-Chip on Board Package,” Current Applied Physics, Vol. 12, No. 2, pp. 494–498, 2012.

    Article  Google Scholar 

  5. Kückmann, O., “High-Power Led Arrays: Special Requirements on Packaging Technology,” Proc. of SPIE, Vol. 6134, Paper No. 613404, 2006.

    Article  Google Scholar 

  6. Petroski, J., “Spacing of High-Brightness Leds on Metal Substrate Pcb's for Proper Thermal Performance,” Proc. of 9th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Vol. 2, pp. 507–514, 2004.

    Article  Google Scholar 

  7. Jinka, K. K., Dasgupta, A., Ganesan, S., and Ling, S., “Chip-on Board Technology for Low Temperature Environment. Part II: Thermomechanical Stresses in Encapsulated Ball-Wedge Bond Wires,” Microelectronics Reliability, Vol. 49, No. 5, pp. 523–529, 2009.

    Article  Google Scholar 

  8. Chien, C. L. C., Huang, Y. C., Hu, S. F., Chang, C. M., Yip, M. C., and Fang, W., “Polymer Dispensing and Embossing Technology for the Lens Type Led Packaging,” Journal of Micromechanics and Microengineering, Vol. 23, No. 6, Paper No. 065019, 2013.

    Article  Google Scholar 

  9. Jeon, E. C., Je, T. J., Lee, E. S., Park, E. S., Lee, J. R., Choi, H., Chang, S., and Choi, S. K., “Optimization of Hybrid Led Package System for Energy Saving based on Micro Machining Technology and Taguchi Method,” Int. J. Precis. Eng. Manuf., Vol. 14, No. 6, pp. 1113–1116, 2013.

    Article  Google Scholar 

  10. Stuart, B. H., “Polymer Analysis,” John Wiley & Sons, p. 218, 2002.

    Google Scholar 

  11. Young, T., “An Essay on the Cohesion of Fluids,” Philosophical Transactions of the Royal Society of London, Vol. 95, pp. 65–87, 1805.

    Article  Google Scholar 

  12. Letellier, P., Mayaffre, A., and Turmine, M., “Drop Size Effect on Contact Angle Explained by Nonextensive Thermodynamics. Young’s Equation Revisited,” Journal of Colloid and Interface Science, Vol. 314, No. 2, pp. 604–614, 2007.

    Article  Google Scholar 

  13. Chung, S. K., Rhee, K., and Cho, S. K., “Bubble Actuation by Electrowetting-on-Dielectric (EWOD) and Its Applications: A Review,” Int. J. Precis. Eng. Manuf., Vol. 11, No. 6, pp. 991–1006, 2010.

    Article  Google Scholar 

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Correspondence to Eun-chae Jeon.

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Jeon, Ec., Lee, JR., Je, TJ. et al. Quantitative analysis on air-dispensing parameters for manufacturing dome lenses of chip-on-board LED system. Int. J. Precis. Eng. Manuf. 15, 2437–2441 (2014). https://doi.org/10.1007/s12541-014-0611-7

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  • DOI: https://doi.org/10.1007/s12541-014-0611-7

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