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Designing of polyamidoamine-based polyurea microcapsules containing tung oil for anticorrosive coating applications

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Abstract

A novel method for the fabrication of robust polyurea microcapsules containing tung oil as a core material was developed for self-healing anticorrosive coating application. Well-distinct microcapsules with polyurea as a shell were prepared by reacting hexamethylene diisocyanate trimer with 0.0 G polyamidoamine (PAMAM) via interfacial polymerization technique. Fourier transform infrared spectroscopic analysis was performed to elucidate the chemical structure of microcapsules as well as to confirm successful encapsulation of core by the polyurea shell. Surface morphology, particle size, distribution of particle size, thermal, and mechanical properties of the prepared PAMAM-based polyurea microcapsules were compared with microcapsules that were prepared using diethylenetriamine (DETA) and triethylenetetramine (TETA). The prepared microcapsules were embedded with acrylic polyol-based polyurethane (PU) coatings to ensure anticorrosive performance. The immersion study of self-healing PU coatings loaded with 5% PAMAM-based polyurea microcapsules possesses satisfactory anticorrosive property under an accelerated corrosion process in 5% NaCl salt solution.

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Acknowledgments

The authors are thankful to Perstorp Chemicals, India for providing the hexamethylene diisocyanate trimer. P. D. Tatiya is grateful for the support from the Department of Science and Technology, New Delhi (India) for providing INSPIRE Research Fellowship.

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Authors and Affiliations

  1. Department of Polymer Chemistry, School of Chemical Sciences, North Maharashtra University, Jalgaon, Maharashtra, 425 001, India

    Pyus D. Tatiya, Pramod P. Mahulikar & Vikas V. Gite

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  1. Pyus D. Tatiya
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  2. Pramod P. Mahulikar
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  3. Vikas V. Gite
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Correspondence to Vikas V. Gite.

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Tatiya, P.D., Mahulikar, P.P. & Gite, V.V. Designing of polyamidoamine-based polyurea microcapsules containing tung oil for anticorrosive coating applications. J Coat Technol Res 13, 715–726 (2016). https://doi.org/10.1007/s11998-015-9780-2

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