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Analysis of Severe Plastic Deformation by Large Strain Extrusion Machining

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Abstract

Large strain extrusion machining (LSEM), a constrained chip formation process, is examined as a method of severe plastic deformation (SPD) at small deformation rates for production of ultra-fine-grained (UFG) materials. A finite element procedure is developed for prediction of deformation field parameters such as effective strain, strain rate, and their variation across the thickness of the chip for various cutting (extrusion) ratios. The cutting force (extrusion pressure) and hydrostatic pressures within the deformation zone are also analyzed. A consideration of the deformation occurring in chip formation suggests bounds on the extrusion ratios that can be realized. Implications of the results for production of bulk chip samples of controlled geometry and with an UFG microstructure are discussed.

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Acknowledgments

We acknowledge NASA GSRP fellowship NND04CR12H and NSF Grant Nos. CMS-0200509 and CMMI-0626047 for support of this work.

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Author notes

  1. M. Sevier (Graduate Student Researcher, Project Engineer)

    Present address: ATA Engineering, Inc., Herndon, VA, 20171, USA

Authors and Affiliations

  1. Department of Mechanical Engineering, University of California, Santa Barbara, CA, 93106, USA

    M. Sevier (Graduate Student Researcher, Project Engineer) & H.T.Y. Yang (Chancellor and Professor)

  2. Center for Materials Processing and Tribology, School of Industrial Engineering, Purdue University, West Lafayette, IN, 47907-2023, USA

    W. Moscoso (Postdoctorate in Industrial Engineering) & S. Chandrasekar (Professor in Industrial and Materials Engineering)

Authors
  1. M. Sevier
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  2. H.T.Y. Yang
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  3. W. Moscoso
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  4. S. Chandrasekar
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Corresponding author

Correspondence to M. Sevier.

Additional information

Manuscript submitted September 26, 2007.

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Sevier, M., Yang, H., Moscoso, W. et al. Analysis of Severe Plastic Deformation by Large Strain Extrusion Machining. Metall Mater Trans A 39, 2645–2655 (2008). https://doi.org/10.1007/s11661-008-9608-0

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