Abstract
Needless to say, the cleanliness levels of chemicals and pure water employed in the cleaning steps of the semiconductor process must be thoroughly maintained and controlled, and we must seek even higher levels of purity. Additionally, particles adhered to the wafer back side also become a source of contamination [1, 2]. However, the cleaning process itself has an even more fundamental problem: although the emission of particles from the fluorocarbon resin-made carrier (also called a Teflon cassette) used for wafer storage and transport causes wafer contamination problems, there has been little attention paid to this point. With the advent of mass production of submicron devices, more than ever a cleaning technology appropriate for wafer carriers is becoming essential.
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References
T. Hattori and S. Koyota: Detecting and Identifying Equipment-Generated Particles for Yield Improvement, Microcontamination, pp. 41–44, 100 (9/1989).
T. Hattori: Particle Reduction in VLSI Manufacturing, in Contamination Control and Defect Reduction in Semiconductor Manufacturing, Electrochemical Society, Pennington, NJ, pp. 3–14 (1994).
See Chapter 10, PFA DATA for Chemical Distribution Systems, in Ultra Clean Technology Series No. 11, Realize Inc., Tokyo, pp. 200–260 (1991).
T. Saga and T. Hattori, Identification and Removal of Trace Organic Contamination on Silicon Wafers Stored in Plastic Boxes, J. Electrochemical Society 143, 3279 (1996).
T. Hattori, S. Koyata, M. Funada, and H. Mishima: Introducing a New PFA Wafer-Carrier Cleaning Technology, Microcontamination ‘81 Conference Proceedings, 552–561; also in Microcontamination, pp. 17–21 (12/1991).
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© 1998 Springer-Verlag Berlin Heidelberg
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Hattori, T. (1998). Wafer Carrier Cleaning. In: Hattori, T. (eds) Ultraclean Surface Processing of Silicon Wafers. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-03535-1_45
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DOI: https://doi.org/10.1007/978-3-662-03535-1_45
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