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LED Die Bonding

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Materials for Advanced Packaging

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Abstract

This chapter addresses the materials for the first step of light-emitting diode (LED) packaging, i.e., LED die attach adhesives (DAAs) and other chip bonding materials. The most significant difference between conventional integrated-circuit (IC) chip DAAs and LED DAAs is that the optical role of LED DAAs becomes the most important factor in additional to the other functions of conventional DAAs, i.e., adhesion and reliability. Thus, the chapter addresses in details of the optical role and optical requirement of LED DAAs and other LED chip bonding materials, in additional to the other conventional aspects of DAAs.

The first section of this chapter will review the function of LED packaging, LED packages, and materials. In the second part, recent development on LED die bonding materials will be introduced. Optical adhesives of different thermal conductivities, adhesive films, eutectic solder pastes, low-temperature sintering silver pastes will be presented in this section. The third part of this chapter provides an overview of most recent advanced LED packaging technologies, including surface-mount device (SMD), chip on board (COB), flip-chip (FC), chip scale package (CSP), and wafer-level CSP packaging (WLCSP), and the interaction between packages and DAAs. Important packaging parameters and their influence on optical and thermal performance of LEDs are elucidated.

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Acknowledgment

The authors would like to thank for the partial financial support provided by Dow Corning and Optobond, Inc.

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Authors and Affiliations

  1. Department of Chemical Engineering and Materials Science, UC Irvine, Irvine, CA, 93697, USA

    Yu-Chou Shih, Jiun-Pyng You & Frank G. Shi Ph.D.

  2. Department of Materials and Manufacturing Technology, UC Irvine, Irvine, CA, 93697, USA

    Gunwoo Kim Ph.D.

Authors
  1. Yu-Chou Shih
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  2. Gunwoo Kim Ph.D.
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  3. Jiun-Pyng You
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  4. Frank G. Shi Ph.D.
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Corresponding author

Correspondence to Yu-Chou Shih .

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Editors and Affiliations

  1. Henkel China Co., Ltd, Shanghai, Shanghai, China

    Daniel Lu

  2. Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia, USA

    C.P. Wong

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Shih, YC., Kim, G., You, JP., Shi, F.G. (2017). LED Die Bonding. In: Lu, D., Wong, C. (eds) Materials for Advanced Packaging. Springer, Cham. https://doi.org/10.1007/978-3-319-45098-8_17

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  • DOI: https://doi.org/10.1007/978-3-319-45098-8_17

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  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-319-45097-1

  • Online ISBN: 978-3-319-45098-8

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