Abstract
Thermomechanical design effects in the printed wiring board (PWB) design process are becoming increasingly important due to ever more stringent electronic product requirements. In the past few years, the finite element method (FEM) has become a vital and effective tool to support many facets of the PWB design process. Despite its increasing popularity in PWB design, the FEM has seldom been validated for its appropriateness and accuracy in modeling PWB thermomechanical behavior. We have conducted a research project in developing advanced FEM-oriented capabilities to simulate thermally induced PWB warpage. The FE analysis results are validated by correlating them with measurements obtained from a separate experimental approach using the shadow moiré method.
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© 1993 Van Nostrand Reinhold
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Yeh, CP., Ume, C., Fulton, R.E., Wyatt, K.W., Stafford, J.W. (1993). Correlation of Analytical and Experimental Approaches to Determination of Thermally Induced Printed Wiring Board (PWB) Warpage. In: Lau, J.H. (eds) Thermal Stress and Strain in Microelectronics Packaging. Springer, Boston, MA. https://doi.org/10.1007/978-1-4684-7767-2_9
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DOI: https://doi.org/10.1007/978-1-4684-7767-2_9
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