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Interconnect and Packaging Technologies for Realizing Miniaturized Smart Devices

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Beyne, E. (2006). Interconnect and Packaging Technologies for Realizing Miniaturized Smart Devices. In: Mukherjee, S., Aarts, R.M., Roovers, R., Widdershoven, F., Ouwerkerk, M. (eds) AmIware Hardware Technology Drivers of Ambient Intelligence. Philips Research, vol 5. Springer, Dordrecht. https://doi.org/10.1007/1-4020-4198-5_7

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  • DOI: https://doi.org/10.1007/1-4020-4198-5_7

  • Publisher Name: Springer, Dordrecht

  • Print ISBN: 978-1-4020-4197-6

  • Online ISBN: 978-1-4020-4198-3

  • eBook Packages: Computer ScienceComputer Science (R0)

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