Abstract
Carbon nanotube (CNT) interconnects have a substantial influence on the performance and power loss of integrated circuits (ICs). When copper’s conductivity declines considerably owing to side effects in future generations of technology, nanotubes, which are rolled-up sheets of carbon one atom thick, hold great potential for fixing some of the most pressing interconnect issues. Carbon nanotubes possess a number of remarkable properties, including very high mechanical strength, stability, and broad electron mean-free paths. This literature review examines the physical circuit design and modelling of carbon nanotubes. At a tolerable working temperature (100 °C), single-wall (SWCNT) and multi-wall carbon nanotube (MWCNT) interconnects are compared to Cu interconnects for possible future improvement. These models accurately represent the size, temperature dependence, and numerous electron photonic scattering mechanisms of quantum conductance. Utilizing a hybrid structure comprised of Cu, SWCNTs, and MWCNTs yields the better network gain. In addition to the delay they provide to important channels, the power they squander, the distortion and vibration they cause each other, and their vulnerability to electron transfer, interconnects are regarded as one of the most significant challenges facing Giga scale integration.
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Mitra, G., Sharda, V., Sharma, R. (2023). Carbon Nanotubes as Interconnects: A Short Review on Modelling and Optimization. In: Hasteer, N., McLoone, S., Khari, M., Sharma, P. (eds) Decision Intelligence Solutions. InCITe 2023. Lecture Notes in Electrical Engineering, vol 1080. Springer, Singapore. https://doi.org/10.1007/978-981-99-5994-5_2
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DOI: https://doi.org/10.1007/978-981-99-5994-5_2
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