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Multi-response Optimization on Process Parameters of WEDM for Ti–6Al–4 V Alloy Using Grey Relational Approach

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Optimization Methods for Product and System Design

Part of the book series: Engineering Optimization: Methods and Applications ((EOMA))

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Abstract

The present article produces an investigation of the material removal rate (MRR) and various surface roughness (SR) response parameters of the wire-cut electric discharge machining (WEDM) process. The paper also discusses the optimization of various machining control parameters using the grey relational analysis (GRA) technique. The investigation has obtained the optimized value of machining process parameters for maximized MRR and minimized surface roughness parameters. For carrying out the experimentation, the design of experiments (DOE) has been designed using the traditional Taguchi DOE approach and the L27 orthogonal array (OA) has been selected. In this regard, the four factors and three levels have been chosen for designing the variation control table for L27 OA, and discharge current (Ip), voltage (V), pulse-on time (Ton) as well as the pulse-off time (Toff) have been selected for variation control factors or variables. The response table based on the investigation and optimized data analysis “compares the relative magnitude of the effects,” including ranks on the basis of delta value. From the main effect plot, it can be clearly seen that the Ip is observed to be the most dominating significant factor over MRR and SR characteristics. The investigation suggests the most optimal process parameters for MRR and surface roughness performance characteristics of the aforementioned machining parameters.

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Correspondence to Kaushik Kumar .

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© 2023 The Author(s), under exclusive license to Springer Nature Singapore Pte Ltd.

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Kumar, R., Kumar, K. (2023). Multi-response Optimization on Process Parameters of WEDM for Ti–6Al–4 V Alloy Using Grey Relational Approach. In: Kulkarni, A.J. (eds) Optimization Methods for Product and System Design. Engineering Optimization: Methods and Applications. Springer, Singapore. https://doi.org/10.1007/978-981-99-1521-7_2

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  • DOI: https://doi.org/10.1007/978-981-99-1521-7_2

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  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-99-1520-0

  • Online ISBN: 978-981-99-1521-7

  • eBook Packages: Computer ScienceComputer Science (R0)

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