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Simulation of Cavities Influence on Insulation Properties of Polymer Dielectrics Under High Voltage Pulse

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The Proceedings of the 17th Annual Conference of China Electrotechnical Society (ACCES 2022)

Part of the book series: Lecture Notes in Electrical Engineering ((LNEE,volume 1012))

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Abstract

Based on the simulation method of partial discharge under AC, the coupling effect of electricity, heat and cavitiy wall are introduced to realize the dynamic simulation of discharge under high voltage pulse. For the common 10–400 μm cavities in polymers, the size has no significant effect on the internal electric field of the cavities, and the discharge increases significantly with the increase of the cavities. When the applied electric field is 20 kV/mm, cavities cause breakdown through cumulative discharge, but cavities less than 10 μm do not cause damage. When the applied electric field is 30 kV/mm, most of the cavities discharge at the same time, the cavities size has a great influence on the thermal breakdown, and the insulation of the polymer fails in a short time. The shape of cavities significantly affects the discharge condition. With the transition of cavities from narrow to flat, the electric field intensity gradually increases, but the temperature and discharge will decreases. Although the electric field in flat cavity is higher, the damage of flat cavities is less than that of narrow cavities from the perspective of thermal breakdown and electric breakdown.

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Acknowledgments

This research is supported by the National Natural Science Foundation of China under Grant 51377135.

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Correspondence to Jing Liu .

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Liu, J., Su, J., Zhao, L., Li, R., Li, H., Zhuang, Q. (2023). Simulation of Cavities Influence on Insulation Properties of Polymer Dielectrics Under High Voltage Pulse. In: Yang, Q., Li, J., Xie, K., Hu, J. (eds) The Proceedings of the 17th Annual Conference of China Electrotechnical Society. ACCES 2022. Lecture Notes in Electrical Engineering, vol 1012. Springer, Singapore. https://doi.org/10.1007/978-981-99-0357-3_19

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  • DOI: https://doi.org/10.1007/978-981-99-0357-3_19

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  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-99-0356-6

  • Online ISBN: 978-981-99-0357-3

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