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High Thermal Conductivity of BN-Filled Polybenzoxazines

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Alloys and Composites of Polybenzoxazines

Part of the book series: Engineering Materials ((ENG.MAT.))

Abstract

This chapter discusses one engineering application of polybenzoxazines as a highly thermally conductive electronic packaging encapsulant. The combination of various useful properties of benzoxazine resins and their resulting polymers has been demonstrated to render a very high thermally conductive polymer composite. Thermal conductivity value as high as 32.5 W/mK in hexagonal boron nitride-filled polybenzoxazine, up to present, remains the highest reported thermal conductivity value in the literature. Other outstanding properties of the resulting composites as an electronic packaging encapsulant are also discussed in this chapter.

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Author information

Authors and Affiliations

  1. Department of Chemical Engineering, Chulalongkorn University, Bangkok, 10330, Thailand

    Sarawut Rimdusit

  2. Department of Chemical Engineering, Srinakharinwirot University, Nakhon Nayok, 26120, Thailand

    Chanchira Jubsilp

  3. Department of Chemistry, Kasetsart University, Nakhon Pathom, 73140, Thailand

    Sunan Tiptipakorn

Authors
  1. Sarawut Rimdusit
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  2. Chanchira Jubsilp
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  3. Sunan Tiptipakorn
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Corresponding author

Correspondence to Sarawut Rimdusit .

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Rimdusit, S., Jubsilp, C., Tiptipakorn, S. (2013). High Thermal Conductivity of BN-Filled Polybenzoxazines. In: Alloys and Composites of Polybenzoxazines. Engineering Materials. Springer, Singapore. https://doi.org/10.1007/978-981-4451-76-5_4

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