Abstract
As discussed in Chapter 1, 3D EM simulation is necessary as the circuit structure is indeed 3D in their actual physical implementation. Most of the 3D EM models in literature use the line-via test structures which are only part of the real circuit structure. To further demonstrate the necessity for complete circuit modeling, the comparison of the EM performances in a circuit structure and a standard line-via test structure is performed in this chapter. Both the EM test condition and the circuit operation condition are considered.
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Tan, C.M., He, F. (2013). Comparison of EM Performances in Circuit and Test Structures. In: Electromigration Modeling at Circuit Layout Level. SpringerBriefs in Applied Sciences and Technology(). Springer, Singapore. https://doi.org/10.1007/978-981-4451-21-5_3
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DOI: https://doi.org/10.1007/978-981-4451-21-5_3
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