Abstract
In order to promote the development of CPU, the intensity of heat emission in limited heat transfer surface becomes larger and larger. Air, water, and ethylene glycol as the common cooling mediums cannot meet the requirement of CPU.
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Acknowledgements
This work is financially supported by “National Natural Science Foundation of China” (Grant No. 51606214), “Natural Science Foundation of Jiangsu Province, China” (Grant No. BK20181359) and “EU ThermaSMART project, H2020-MSCA-RISE (778104)-Smart thermal management of high power microprocessors using phase-change (ThermaSMART).”
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Qi, C., Tang, J., Chen, T., Liu, M., Wang, G., Yan, Y. (2021). Influence of Nanofluids Inlet and Outlet Positions on CPU Cooling Performance. In: Wen, C., Yan, Y. (eds) Advances in Heat Transfer and Thermal Engineering . Springer, Singapore. https://doi.org/10.1007/978-981-33-4765-6_86
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DOI: https://doi.org/10.1007/978-981-33-4765-6_86
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