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Research on Construction of Campus Smart Card System and Digital Campus

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Big Data Analytics for Cyber-Physical System in Smart City (BDCPS 2020)

Part of the book series: Advances in Intelligent Systems and Computing ((AISC,volume 1303))

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Abstract

With the development of modern information, the construction of a digital campus is inseparable from the support of campus smart card system which provides a good information sharing environment and provides more comprehensive data collection for the construction of a digital campus. Therefore, the complete integrated digital campus perfects the campus application platform center with richer and unified content, including identity authentication platforms, public data centers, and security information systems. These application platforms will be implemented throughout the entire application system on campus. In addition, the use of the campus card perfects the information management of various departments on campus, and promotes the construction of digital campus.

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Author information

Authors and Affiliations

  1. Modern Educational Technology Center of Nanchong Campus, Southwest Petroleum University, Nanchong, 637001, SiChuan, China

    Xiyuan Yin

Authors
  1. Xiyuan Yin
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Correspondence to Xiyuan Yin .

Editor information

Editors and Affiliations

  1. School of Computer Science, University of Oklahoma, Norman, OK, USA

    Mohammed Atiquzzaman

  2. University of Aizu, Fukushima, Japan

    Neil Yen

  3. Shanghai University of Medicine and Health Sciences, Shanghai, China

    Zheng Xu

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© 2021 The Editor(s) (if applicable) and The Author(s), under exclusive license to Springer Nature Singapore Pte Ltd.

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Yin, X. (2021). Research on Construction of Campus Smart Card System and Digital Campus. In: Atiquzzaman, M., Yen, N., Xu, Z. (eds) Big Data Analytics for Cyber-Physical System in Smart City. BDCPS 2020. Advances in Intelligent Systems and Computing, vol 1303. Springer, Singapore. https://doi.org/10.1007/978-981-33-4572-0_101

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  • DOI: https://doi.org/10.1007/978-981-33-4572-0_101

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  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-33-4573-7

  • Online ISBN: 978-981-33-4572-0

  • eBook Packages: Computer ScienceComputer Science (R0)

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