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Design and Numerical Simulation of PCM-Based Energy Storage Device for Helmet Cooling

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Intelligent Manufacturing and Energy Sustainability

Part of the book series: Smart Innovation, Systems and Technologies ((SIST,volume 213))

Abstract

Thermal energy storage systems have gained importance in the designing of cooling system for micro-electronic and energy-efficient devices. An attempt has been made for designing cooling technique in the helmet namely PCM packet and its performance analysis was carried out numerically. The PCM packet consists of PCM filled pipes and passage for air. The device is intended to provide thermal comfort by reducing the outside air temperature to comfort temperature with the help of latent heat storage PCM material. Two PCM packet positions vertical, horizontal and PCM pipes are filled with paraffin (RT50) PCM. The results of both the systems are presented in terms of liquid fraction, local temperature distribution of PCM, and average air outlet temperature. It is predicted from the results that outside air temperature decreased with the PCM packet held in horizontal position.

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References

  1. F. Agyenim, N. Hewitt, P. Eames, M. Smyth, A review of materials, heat transfer and phase change problem formulation for latent heat thermal energy storage systems (LHTESS). Renew. Sustain. Energy Rev. 14, 615–628 (2010)

    Article  Google Scholar 

  2. H. Shmueli, G. Ziskind, R. Letan, Melting in a vertical cylindrical tube: numerical investigation and comparison with experiments. Int. J. Heat Mass Transf. 53, 4082–4091 (2010)

    Article  Google Scholar 

  3. A.H. Mosaffa, F. Talati, H. Basirat Tabrizi, M.A. Rosenc, Analytical modeling of PCM solidification in a shell and tube finned thermal storage for air conditioning systems. Energy Build. 49, 356–361 (2012)

    Article  Google Scholar 

  4. A. Al-abidi, B.M. Sohif, K. Sopian, M.Y. Sulaiman, T.M. Abdulrahman, CFD applications for latent heat thermal energy storage. Renew. Sustain. Energy Rev. 20,353–363 (2013)

    Google Scholar 

  5. H.M. Ali, A. Arshad, Experimental investigation of n-eicosane based circular pin-fin heat sinks for passive cooling of electronic devices. Int. J. Heat Mass Transf. 112, 649–661 (2017)

    Article  Google Scholar 

  6. R. Baby, C. Balaji, Thermal management of electronics using phase change material based pin fin heat sinks. J. Phys.: Conf. Ser. 395, 012134 (2012)

    Google Scholar 

  7. T. Rozenfeld, Y. Kozak, R. Hayat, G. Ziskind, Close-contact melting in a horizontal cylindrical enclosure with longitudinal plate fins: demonstration, modeling and application to thermal storage. Int. J. Heat Mass Transf. 86, 465–477 (2015)

    Article  Google Scholar 

  8. A. Sciacovelli, F. Gagliardi, V. Verda, Maximization of performance of a PCM latent heat storage system with innovative fins. Appl. Energy 137, 705–715 (2015)

    Article  Google Scholar 

  9. N.S. Bondareva, M.A. Sheremet, Conjugate heat transfer in the PCM-based heat storage system with finned copper profile: application in electronics cooling. Int. J. Heat Mass Transf. 124, 1275–1284 (2018)

    Article  Google Scholar 

  10. M.J. Huang, P.C. Eames, B. Norton, N.J. Hewitt, Natural convection in an internally finned phase change material heat sink for the thermal management of photovoltaics. Solar Energy Mater. Solar Cells. 95, 1598–1603 (2011)

    Google Scholar 

  11. N.S. Dhaidan, A.F. Khalaf, Experimental evaluation of the melting behaviours of paraffin within a hemicylindrical storage cell. Int. Commun. Heat Mass Transf. 111, 104476 (2020)

    Article  Google Scholar 

  12. Z. Li, L. Lv, J. Li, Combination of heat storage and thermal spreading for high power portable electronics cooling. Int. J. Heat Mass Transf. 98, 550–557 (2016)

    Article  Google Scholar 

  13. S. Wang, A. Faghri, T.L. Bergman, A comprehensive numerical model for melting with natural convection. Int. J. Heat Mass Transfer. 53,1986–2000 (2010)

    Google Scholar 

  14. H. Zennouhi, W. Benomar, T. Kousksou, A. AitMsaad, A. Allouhi, M. Mahdaoui, T. El Rhafikia, Effect of inclination angle on the melting process of phase change material. Case Stud. Therm. Eng. 9, 47–54 (2017)

    Article  Google Scholar 

  15. X. Sun, Q. Zhang, M.A. Medina, K. OkLee, Experimental observations on the heat transfer enhancement caused by natural convection during melting of solid–liquid phase change materials (PCMs). Appl. Energy 162, 1453–1461 (2016)

    Google Scholar 

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Authors and Affiliations

  1. Mechanical Engineering Department, GITAM Deemed to be University, Visakhapatnam, India

    Nagaraju Dora & Ch Srinivasa Rahul

  2. Graduate Engineer Trainee (GET), TVS Motors, Bengaluru, India

    Ch Ramsai

Authors
  1. Nagaraju Dora
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  2. Ch Ramsai
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  3. Ch Srinivasa Rahul
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Corresponding author

Correspondence to Nagaraju Dora .

Editor information

Editors and Affiliations

  1. Department of Mechanical Engineering, Malla Reddy College Engineering and Technology, Secunderabad, Telangana, India

    A.N.R. Reddy

  2. Department of Mechanical Engineering, Indian Institute of Technology Bombay, Mumbai, India

    Deepak Marla

  3. Department of Informatics and Computer Techniques, Siberian State University of Science and Technology, Krasnoyarsk, Russia

    Margarita N. Favorskaya

  4. School of Computer Engineering, KIIT University, Bhubaneswar, Odisha, India

    Suresh Chandra Satapathy

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Dora, N., Ramsai, C., Srinivasa Rahul, C. (2021). Design and Numerical Simulation of PCM-Based Energy Storage Device for Helmet Cooling. In: Reddy, A., Marla, D., Favorskaya, M.N., Satapathy, S.C. (eds) Intelligent Manufacturing and Energy Sustainability. Smart Innovation, Systems and Technologies, vol 213. Springer, Singapore. https://doi.org/10.1007/978-981-33-4443-3_5

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  • DOI: https://doi.org/10.1007/978-981-33-4443-3_5

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  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-33-4442-6

  • Online ISBN: 978-981-33-4443-3

  • eBook Packages: EngineeringEngineering (R0)

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