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Digital Signatures Using Hardware Security Modules for Electronic Bills in Vietnam: Open Problems and Research Directions

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Future Data and Security Engineering. Big Data, Security and Privacy, Smart City and Industry 4.0 Applications (FDSE 2020)

Part of the book series: Communications in Computer and Information Science ((CCIS,volume 1306))

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Abstract

The usage of electronic bills in Vietnam become more popular in recent years. As required by law, the e-bills need to be signed digitally. Deploying the digital signature services in practice raised new issues in security and usability. In this paper we describe some open practical problems in deploying digital signature service in Vietnam. We discuss the research directions that address the issues. We draw the research plan to resolve the problems in the industry.

M.- T. Truong and Q.- V. Dang—Authors contributed equally to this work.

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Notes

  1. 1.

    Named as the “decree prescribing electronic invoices for sale of goods and provision of services.", issued on 12-September-2018.

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Author information

Authors and Affiliations

  1. Industrial University of Ho Chi Minh city, Ho Chi Minh City, Vietnam

    Minh-Tuan Truong & Quang-Vinh Dang

Authors
  1. Minh-Tuan Truong
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  2. Quang-Vinh Dang
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Corresponding author

Correspondence to Minh-Tuan Truong .

Editor information

Editors and Affiliations

  1. Ho Chi Minh City University of Technology, Ho Chi Minh City, Vietnam

    Tran Khanh Dang

  2. Johannes Kepler University of Linz, Linz, Austria

    Josef Küng

  3. Hosei University, Tokyo, Japan

    Makoto Takizawa

  4. Sungkyunkwan University, Suwon, Korea (Republic of)

    Tai M. Chung

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Truong, MT., Dang, QV. (2020). Digital Signatures Using Hardware Security Modules for Electronic Bills in Vietnam: Open Problems and Research Directions. In: Dang, T.K., Küng, J., Takizawa, M., Chung, T.M. (eds) Future Data and Security Engineering. Big Data, Security and Privacy, Smart City and Industry 4.0 Applications. FDSE 2020. Communications in Computer and Information Science, vol 1306. Springer, Singapore. https://doi.org/10.1007/978-981-33-4370-2_35

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  • DOI: https://doi.org/10.1007/978-981-33-4370-2_35

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  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-33-4369-6

  • Online ISBN: 978-981-33-4370-2

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