Investigation for a Phase Change Immersion Cooling System
In this paper, an immersion phase change cooling system is designed, in which an electronic fluoride solution is injected into the blade under the design background of the blade server. The system consists of four parallel blade servers with a maximum heating power of 1.2 kW per blade. When the submerged cooling system works normally, the liquid cooling medium is heated by the heating chip in the blade server and phase change occurs. The float continuous level gauge and the liquid cooling source control system make the heating resistance completely immersed in the electronic fluoride solution.
The thermal resistance is used to simulate the heating of electronic devices, and a heat dissipation performance test system is established. The experimental results show that when the cooling system designed in this paper works normally, the surface temperature of the cooled heat source is below 70 C, and the temperature near the resistance on the outside of the blade fluctuates around 71.3 C. The system designed in this paper can run stably and effectively cool the heating parts in the blade.
KeywordsImmersion cooling Electronic chip Data center heat dissipation High efficiency cooling technology
- 1.Xiong, S.M., Wang, Y.H., Zhou, T.J., et al.: Review on immersion phase change cooling. Build. Energy Environ. 37(8), 33–37 (2018)Google Scholar
- 2.John, R.S., Avram, B.C., Tien, L., et al.: Fluid selection and property effects in single and two-phase immersion cooling. IEEE Trans. Compon. Hybrids Manuf. Technol. 11(4), 557–565 (1988)Google Scholar
- 5.Mohapatra, S.C.: An overview of liquid coolants for electronics cooling. Electron. Cool. 12(5), 1–6 (2006)Google Scholar
- 6.Arik, M., Bar-Cohen, A.: Ebullient cooling of integrated circuits by NOVEC fluids. Adv. Electron. Packag. 2, 625–637 (2001)Google Scholar