Analysis of Temperature at Substrate and Sink Area of 5 W COB-Type LEDs, with and Without Driver
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In recent year, Light-Emitting Diodes (LEDs) have been widely used due to their excellent advantages over conventional light sources, e.g., like incandescent lamps, gas discharge lamps, etc., with their high efficacy, low power consumption, and long lifetime. Reliability and long lifetime will determine the economical and ecological success of LED in lighting systems. LED systems can in general reach very long lifetime of up to 200,000 h with appropriate designed. For solid state, LEDs, the light output, efficiency, spectral distribution and lifetime is strongly dependent on operating temperature. In this study, the thermal tests under ambient temperature have been performed. The temperature build up at the substrate area and sink area has been measured by the Thermal IR imager at every 5 min interval. Two processes have been adopted. Initially the measurement of temperature was done and recorded when the LEDs are connected with constant 300 mA driver and another is when LEDs are connected with rated DC power supply, i.e., without driver condition. To find the extra heat generation using driver or not. But the temperature generation is nearly same for both the conditions, however details experimental results has been furnished and analyzed herein after.
KeywordsChip-on-board (COB) Correlated color temperature (CCT) Substrate area Sink area
The authors wish to acknowledge the Government of West Bengal, India for providing the fellowship. Authors wish to acknowledge the support received from School of Illumination Sciences, Engineering & Design of Jadavpur University for facilitate with experimental set up to complete this work at the laboratory, therein.
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