Skip to main content

Analysis of Temperature at Substrate and Sink Area of 5 W COB-Type LEDs, with and Without Driver

  • Conference paper
  • First Online:
Advances in Control, Signal Processing and Energy Systems

Part of the book series: Lecture Notes in Electrical Engineering ((LNEE,volume 591))

  • 287 Accesses

Abstract

In recent year, Light-Emitting Diodes (LEDs) have been widely used due to their excellent advantages over conventional light sources, e.g., like incandescent lamps, gas discharge lamps, etc., with their high efficacy, low power consumption, and long lifetime. Reliability and long lifetime will determine the economical and ecological success of LED in lighting systems. LED systems can in general reach very long lifetime of up to 200,000 h with appropriate designed. For solid state, LEDs, the light output, efficiency, spectral distribution and lifetime is strongly dependent on operating temperature. In this study, the thermal tests under ambient temperature have been performed. The temperature build up at the substrate area and sink area has been measured by the Thermal IR imager at every 5 min interval. Two processes have been adopted. Initially the measurement of temperature was done and recorded when the LEDs are connected with constant 300 mA driver and another is when LEDs are connected with rated DC power supply, i.e., without driver condition. To find the extra heat generation using driver or not. But the temperature generation is nearly same for both the conditions, however details experimental results has been furnished and analyzed herein after.

This is a preview of subscription content, log in via an institution to check access.

Access this chapter

Chapter
USD 29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD 129.00
Price excludes VAT (USA)
  • Available as EPUB and PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD 169.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info
Hardcover Book
USD 169.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Institutional subscriptions

References

  1. http://ujala.gov.in/documents/Final_Monitoring_and_Verificatio_Report_EESL.pdf

  2. Zhong D, Zhang J (2011) Thermal and optical simulation of high-power LED array based on Silicon heatsink. IEEE, 978-1-4577-0321-8/11

    Google Scholar 

  3. Kiseev V, Aminev D, Sazhin O (2017) Two-phase nanofluid-based thermal management systems for LED cooling. STPM2017 IOP Conference on series: materials science and engineering. https://doi.org/10.1088/1757-899x/192/1/012020

    Article  Google Scholar 

  4. Mohamad MS, Abdullah MZ, Abdullah MK (2013) Experimental study on the cooling performance of high power LED arrays under natural convection. In: 2nd international conference on mechanical engineering research (ICMER 2013) IOP conference on series: materials science and engineering. https://doi.org/10.1088/1757-899x/50/1/012030

    Article  Google Scholar 

  5. Elger G, Hanss A, Schmid M, Wipiejewski T (2014) Application of thermal analysis for the development of reliable high power LED modules. IEEE, 978-1-4799-6697-4

    Google Scholar 

  6. Chen Z, Zhang Q, Chen R, Jiao F, Chen M, Luo X, Liu S (2011) Comparison of LED package reliability under thermal cycling and thermal shock conditions by experimental testing and finite element simulation. In: Electronic components and technology conference (ECTC). IEEE. https://doi.org/10.1109/ectc.2011.5898550

  7. Chen Q, Chen Q, Hu R, Luo X (2014) Is thermal management outside the package enough for higher LED reliability. IEEE, 978-1-4799-4707-2/14

    Google Scholar 

  8. Chhajed S, Xi Y, Gessmanna T, Xi J-Q, Shah JM, Kim JK, Schubert EF (2005) Junction temperature in light-emitting diodes assessed by different methods. Rensselaer Polytechnic Institute Troy, NY, p 12180

    Google Scholar 

  9. Narendran N, Liu Y-W, LED life versus LED system life. Lighting Research Center Rensselaer Polytechnic Institute Troy, NY

    Google Scholar 

  10. Chen Q, Luo X, Zhou S, Liu S (2011) Dynamic junction temperature measurement for high power light emitting diodes. American Institute of Physics, 0034-6748/2011/82(8)/084904/7

    Google Scholar 

  11. Tang Y, Liu D, Yang H, Yang P (2016) Thermal effects on LED lamp with different thermal interface materials. IEEE Trans Electron Devices 63(12):4819–4824. https://doi.org/10.1109/TED.2016.2615882

    Article  Google Scholar 

Download references

Acknowledgements

The authors wish to acknowledge the Government of West Bengal, India for providing the fellowship. Authors wish to acknowledge the support received from School of Illumination Sciences, Engineering & Design of Jadavpur University for facilitate with experimental set up to complete this work at the laboratory, therein.

Author information

Authors and Affiliations

Authors

Corresponding author

Correspondence to Debashis Raul .

Editor information

Editors and Affiliations

Rights and permissions

Reprints and permissions

Copyright information

© 2020 Springer Nature Singapore Pte Ltd.

About this paper

Check for updates. Verify currency and authenticity via CrossMark

Cite this paper

Raul, D. (2020). Analysis of Temperature at Substrate and Sink Area of 5 W COB-Type LEDs, with and Without Driver. In: Basu, T., Goswami, S., Sanyal, N. (eds) Advances in Control, Signal Processing and Energy Systems. Lecture Notes in Electrical Engineering, vol 591. Springer, Singapore. https://doi.org/10.1007/978-981-32-9346-5_11

Download citation

  • DOI: https://doi.org/10.1007/978-981-32-9346-5_11

  • Published:

  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-32-9345-8

  • Online ISBN: 978-981-32-9346-5

  • eBook Packages: EngineeringEngineering (R0)

Publish with us

Policies and ethics