Abstract
The micro-pin-fin heat sink with checkerboard nozzles has shown its ultra-high flux heat transfer capability, which has the potential to solve the critical problem for VLSI technology. In this paper, a numerical simulation analysis is carried out on the morphologic design, geometric parameters, and operating conditions. The calculation models on the cylinder, cone, round table, and bullet micro-pin-fins are established. The heat transfer performance of each morphologic structure is analyzed. The calculation results show that the pressure drop of the morphologic structure of the cylinder is small, but the eddy current also limits the heat transfer effect. It has obvious advantages when the truncated cone morphology is applied to the heat exchange unit. The pressure drop is only 5011.26 Pa, while the thermal resistance can be as low as 1.39 × 10–5 Km2/W.
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Lv, H., He, K., Ju, X. (2023). Optimization and Numerical Investigation of Micro-pin-Fin Structure on Heat Sink with Checkerboard Nozzles. In: Wang, Y., Liu, Y., Zou, J., Huo, M. (eds) Signal and Information Processing, Networking and Computers. ICSINC 2022. Lecture Notes in Electrical Engineering, vol 996. Springer, Singapore. https://doi.org/10.1007/978-981-19-9968-0_18
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DOI: https://doi.org/10.1007/978-981-19-9968-0_18
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