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Cross-Scale Integrated Manufacturing of Nanostructures and Devices

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Fundamental Research on Nanomanufacturing

Part of the book series: Reports of China’s Basic Research ((RCBR))

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Abstract

On the basis of nanoprecision manufacturing and nanostructure manufacturing, the integration of nano/sub-nano precision and micro-nano multiscale structures and cross-scale manufacturing are the only way for nanomanufacturing to move towards industrial application and serve major national engineering applications. Taking the manufacture of biochemical sensor as an example, its sensing process includes two interfaces: the reaction interface at the level of biochemical molecules (the first interface) and the conversion interface between information and energy of sensing output electrical signals (the second interface).

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Authors and Affiliations

  1. Xi’an Jiaotong University, Xi’an, Shaanxi, China

    Bingheng Lu

  2. Tsinghua University, Beijing, China

    Jianbin Luo

  3. Xiamen University, Xiamen, Fujian, China

    Zhongqun Tian

  4. Dalian University of Technology, Dalian, Liaoning, China

    Dongming Guo

  5. Huazhong University of Science and Technology, Wuhan, Hubei, China

    Han Ding

  6. Institute of Physics, Chinese Academy of Sciences, Beijing, China

    Changzhi Gu

  7. Tianjin University, Tianjin, China

    Zhihong Li

  8. School of Microelectronics, University of Science and Technology of China, Hefei, Anhui, China

    Ming Liu

Authors
  1. Bingheng Lu
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  2. Jianbin Luo
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  3. Zhongqun Tian
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  4. Dongming Guo
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  5. Han Ding
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  6. Changzhi Gu
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  7. Zhihong Li
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  8. Ming Liu
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Corresponding author

Correspondence to Bingheng Lu .

Editor information

Editors and Affiliations

  1. Xi'an Jiaotong University, Xi'an, Shaanxi, China

    Bingheng Lu

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Lu, B. et al. (2023). Cross-Scale Integrated Manufacturing of Nanostructures and Devices. In: Lu, B. (eds) Fundamental Research on Nanomanufacturing. Reports of China’s Basic Research. Springer, Singapore. https://doi.org/10.1007/978-981-19-8975-9_5

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  • DOI: https://doi.org/10.1007/978-981-19-8975-9_5

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  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-19-8974-2

  • Online ISBN: 978-981-19-8975-9

  • eBook Packages: EngineeringEngineering (R0)

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