Analysis and Testing of Space Electronics’ Package to Meet Launch Vehicle Vibration Loads

Abstract

Satellite consists of many electronic packages, and during the launch of a satellite, it will be subjected to high random vibration loads which are generated by the launch vehicle. These electronic packages also known as modules, systems and/or subsystems will experience these vibration loads when mounted in the satellite and must be designed and qualified to meet these launch loads. These modules house the Printed Circuit Board (PCB) on which critical components such as HMCs, capacitors, CCGAs, flat packs and other leaded components, which are prone to vibration failures, need to be taken care during the design phase. Above all these components are high reliable and high cost items, this puts the constraint of first time right, and no failure is allowed. Hence, structural design and analysis become most important stage before manufacturing and testing the packages. This paper discusses one of the electronic packages designed for Indian communication satellite to meet such vibration loads and methods used to analyze the package virtually (through analysis software) before testing which saves the time and cost by reducing the number of prototypes. Three analyses (Eigen value analysis, quasi static analysis and random vibration analysis) have been carried out to qualify the module virtually by finite element method. Modal analysis has been carried out to determine the natural frequency and modal effective mass of the module. Quasi static analysis has been carried out to determine the stresses. Random vibration analysis has been carried out to see the acceleration levels and overall g_rms along with the stress levels experienced by the components. Based on the analyses, the qualification model (QM) was built and validated through testing after which the proto-flight model (PFM) and flight models were built.