Abstract
A digital replica of any physical system or process is referred to as a digital twin (DT). In general, a DT is a software program that accepts real-world data of a physical system at ground level as inputs and creates useful outputs in the form of insights. At the moment, the manufacturing industry and business are concentrating their efforts on this technology. Due to the outbreak of COVID-19, the entire globe has turned to virtual meetings and live video interactions in various fields as health care, business, and education. We explore the most recent viewpoints and future technology trends that are most likely to drive DT in this study. The incorporation of blockchain in DT will allow the network to efficiently monitor and manage resource consumption and sharing. The idea of a digital twin of a smart city is presented in this article. Smart city development aims to enhance not just the city's overall performance, but also its basic infrastructure, procedures, and facilities, as well as its socioeconomic wellbeing. In order to strengthen security and privacy in smart cities, we examine how security may influence the DT. We offer a complete analysis of blockchain-based DT in this article. Overall, our study aims to give insightful direction for digital twin security and privacy research.
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References
Shi, K., Zhu, L., Zhang, C., Xu, L., Gao, F.: Blockchain-based multimedia sharing in vehicular social networks with privacy protection. Multimed. Tools Appl. 79(11), 8085–8105 (2020). https://doi.org/10.1007/S11042-019-08284-8
Barricelli, B.R., Casiraghi, E., Fogli, D.: A survey on digital twin: definitions, characteristics, applications, and design implications. IEEE Access 7 (2019) https://doi.org/10.1109/ACCESS.2019.2953499
Minerva, R., Crespi, N.: Digital Twins: properties, software frameworks, and application scenarios. IT Prof. 23, 51–55 (2021). https://doi.org/10.1109/MITP.2020.2982896
Suhail, S., Hussain, R., Jurdak, R., Hong, C.S.: Trustworthy digital twins in the industrial internet of things with blockchain. IEEE Internet Comput. (2021). https://doi.org/10.1109/MIC.2021.3059320
Rasheed, A., San, O., Kvamsdal, T.: Digital twin: values, challenges and enablers from a modeling perspective. IEEE Access 8, 21980–22012 (2020). https://doi.org/10.1109/ACCESS.2020.2970143
Tao, F., Zhang, H., Liu, A., Nee, A.Y.C.: Digital twin in industry: state-of-the-art. IEEE Trans. Ind. Inf. 15, 2405–2415 (2019). https://doi.org/10.1109/TII.2018.2873186
Yaqoob, I., Salah, K., Uddin, M., Jayaraman, R., Omar, M., Imran, M.: Blockchain for digital twins: recent advances and future research challenges. IEEE Netw. 34, 290–298 (2020). https://doi.org/10.1109/MNET.001.1900661
Tao, F., Zhang, M.: Digital twin shop-floor: a new shop-floor paradigm towards smart manufacturing. IEEE Access 5, 20418–20427 (2017). https://doi.org/10.1109/ACCESS.2017.2756069
Zhang, C., Zhou, G., Li, H., Cao, Y.: Manufacturing blockchain of things for the configuration of a data- and knowledge-driven digital twin manufacturing cell. IEEE Internet Things. J. 7, 11884–11894 (2020). https://doi.org/10.1109/JIOT.2020.3005729
Dietz, M., Pernul, G.: Unleashing the digital twin’s potential for ICS security. IEEE Secur. Priv. 18, 20–27 (2020). https://doi.org/10.1109/MSEC.2019.2961650
Bilberg, A., Malik, A.A.: Digital twin driven human–robot collaborative assembly. CIRP Ann. 68, 499–502 (2019). https://doi.org/10.1016/J.CIRP.2019.04.011
Alcácer, V., Cruz-Machado, V.: Scanning the industry 4.0: a literature review on technologies for manufacturing systems. Eng. Sci. Technol. Int. J. 22, 899–919 (2019). https://doi.org/10.1016/J.JESTCH.2019.01.006
Wan, S., Umer, T., Bashir, A.K.: Blockchain-enabled multimedia in industrial IoT. Multimed. Tools Appl. 79(15), 9709–9709 (2020). https://doi.org/10.1007/S11042-019-08541-W
Yamashita, K., Nomura, Y., Zhou, E., Pi, B., Jun, S.: Potential risks of hyperledger fabric smart contracts. In: IWBOSE 2019–2019 IEEE 2nd International Workshop on Blockchain Oriented Software Engineering, pp. 1–10. Institute of Electrical and Electronics Engineers Inc. (2019). https://doi.org/10.1109/IWBOSE.2019.8666486
Tao, F., Cheng, J., Qi, Q., Zhang, M., Zhang, H., Sui, F.: Digital twin-driven product design, manufacturing and service with big data. Int. J. Adv. Manuf. Technol. 949(94), 3563–3576 (2017). https://doi.org/10.1007/S00170-017-0233-1
Mandolla, C., Petruzzelli, A.M., Percoco, G., Urbinati, A.: Building a digital twin for additive manufacturing through the exploitation of blockchain: a case analysis of the aircraft industry. Comput. Ind. 109, 134–152 (2019). https://doi.org/10.1016/J.COMPIND.2019.04.011
Petrik, D., Herzwurm, G.: IIoT ecosystem development through boundary resources: a siemens mind sphere case study. IWSiB 2019—Processing 2nd ACM SIGSOFT International Work Software-Intensive Business Start-ups, Platforms, Ecosystem co-located with ESEC/FSE, pp. 1–6 (2019). https://doi.org/10.1145/3340481.3342730
Vrabič, R., Erkoyuncu, J.A., Butala, P., Roy, R.: Digital twins: understanding the added value of integrated models for through-life engineering services. Procedia Manuf. 16, 139–146 (2018). https://doi.org/10.1016/J.PROMFG.2018.10.167
Madni, A.M., Madni, C.C., Lucero, S.D.: Leveraging digital twin technology in model-based systems engineering. Syst. 7, 7 (2019) https://doi.org/10.3390/SYSTEMS7010007
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Samanta, S., Sarkar, A., Bulo, Y. (2022). Secure Smart City Infrastructure Using Digital Twin and Blockchain. In: Goar, V., Kuri, M., Kumar, R., Senjyu, T. (eds) Advances in Information Communication Technology and Computing. Lecture Notes in Networks and Systems, vol 392. Springer, Singapore. https://doi.org/10.1007/978-981-19-0619-0_33
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