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Wire Bonding Design in Detail

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MicroSystem Based on SiP Technology

Abstract

Wire Bonding, sometimes called Bond Wire. Wire Bonding emphasizes the entire bonding process, while Bond Wire refers to the bond wire itself.In practice, no strict distinction is usually made.

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Correspondence to Suny Li .

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Li, S. (2022). Wire Bonding Design in Detail. In: Li, S. (eds) MicroSystem Based on SiP Technology. Springer, Singapore. https://doi.org/10.1007/978-981-19-0083-9_11

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  • DOI: https://doi.org/10.1007/978-981-19-0083-9_11

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  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-19-0082-2

  • Online ISBN: 978-981-19-0083-9

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