Abstract
This chapter addresses the importance of soldering and describes briefly the sequence of events occurring during the soldering operation. It touches upon the classification of solder wetting correlating to the dihedral angle of wetting. It describes the general flux formulations and the reflow profile. The guidelines formulated for production flow of electronic packages based on detailed experiments and validation have been tabulated. The defects on soldering of chip resistors, chip capacitors, surface mounted integrated circuits, OSM connectors, jumper wires and other defects have been captured, and all have been illustrated with high resolution photographic images. Formation of solder bumps, solder balls, cold joints and the tombstoning defect have been discussed. The defect due to presence of flux residues has also been touched upon. The methods for mitigation/elimination of these defects have also been explained. A total of 45 live cases under 22 groups is presented.
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
References
Altera Corporation (2008) Reflow soldering guidelines for surface-mount devices. Application note: 81, vol 81, no 4, pp 1–10
Baluch D, Minogue G (2007) Fundamentals of solder paste technology. Global SMT Packag Mag 16(12):14–18
Bjorn D, Lasky RC (2004) Optimizing your reflow profile for maximum productivity and profitability. APEX, Anaheim CA
Buetow M (2015) Solder fatigue led to AirAsia crash, investigators say. Published 01 Dec 2015
Coenen N. Jetting solder paste opens up new possibilities in your SMT production. Originally published in the SMTA proceedings
Flanagan K (2018) Stages of a reflow profile: part III. Indium Corporation
Harris PG, Chaggar KS (1998) Role of intermetallic compounds in lead-free soldering. Soldering Surf Mount Technol 38–52
Mar NSS, Fookes C, Yarlagadda PKDV (2009) Design of automatic vision-based inspection system for solder joint segmentation. J Achievements Mater Manuf Eng 34(2):145–151
Mark-10 Corporation (2017) User’s guide to ESM 303 force test stand. 32-1189 Rev 0517
Milos D, Jaspan N, Christopher H (2000) The use of shear testing and thermal cycling for assessment of solder joint reliability. NPL Report CMMT (A) 268
Rajewski K (1995) SMT process recommendations. Defect minimization methods for a no-clean SMT process. IEEE Technical Applications Conference and Workshops. Northcon/95. Conference Record, pp 354–362. https://doi.org/10.1109/NORTHC.1995.485096
Schwartz M (2014) Soldering: Understanding the basics. ASM International, USA , March 31. ISBN: 978-1-62708-058-3
Turnbull RB (1986) Blowholes in PCB Soldering Their Causes and Cures. Circuit World 12(2):59-61. https://doi.org/10.1108/eb043801
Webster J, Pan J, Toleno BJ (2007) Investigation of the lead-free solder joint shear performance. Int Micro-electron Packag Soc JMEP 72–77
Yang Y (2017) Failure analysis for bad wetting on HASL PCB. In: Proceedings of 18th IEEE international conference on electronic packaging technology, pp 126–129
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
Copyright information
© 2022 The Author(s), under exclusive license to Springer Nature Singapore Pte Ltd.
About this chapter
Cite this chapter
Kuttiyil Thomas, O.T., Gopalan, P.P. (2022). Soldering Defects. In: Electronics Production Defects and Analysis. Springer Tracts in Electrical and Electronics Engineering. Springer, Singapore. https://doi.org/10.1007/978-981-16-9824-8_2
Download citation
DOI: https://doi.org/10.1007/978-981-16-9824-8_2
Published:
Publisher Name: Springer, Singapore
Print ISBN: 978-981-16-9823-1
Online ISBN: 978-981-16-9824-8
eBook Packages: EngineeringEngineering (R0)