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Deposition of Microparticles with Coulomb Repulsion

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Microparticle Dynamics in Electrostatic and Flow Fields

Part of the book series: Springer Theses ((Springer Theses))

Abstract

Packing of charged micron-sized particles is investigated using discrete element simulations based on adhesive contact dynamic models. The formation process and the final obtained structures of ballistic packings are studied to show the effect of interparticle Coulomb force. It is found that increasing the charge on particles causes a remarkable decrease of the packing volume fraction and the average coordination number, indicating a looser and chainlike structure. Force scaling analysis shows that the long-range Coulomb interaction changes packing structures through its influence on the particle inertia before they are bonded into the force networks. Once the contact network are formed, the expansion effect caused by the repulsive Coulomb forces are inhibited by the short-range adhesion. Based on abundant results from simulations, a dimensionless adhesion parameter, Ad, which combines the effects of the particle inertia, the short-range adhesion and the long-range Coulomb interaction, is proposed, which successfully scales the packing results for micron particles

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Author information

Authors and Affiliations

  1. Department of Energy and Power Engineering, Tsinghua University, Beijing, China

    Sheng Chen

  2. School of Energy and Power Engineering, Huazhong University of Science and Technology, Wuhan, China

    Sheng Chen

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  1. Sheng Chen
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Correspondence to Sheng Chen .

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Chen, S. (2023). Deposition of Microparticles with Coulomb Repulsion. In: Microparticle Dynamics in Electrostatic and Flow Fields. Springer Theses. Springer, Singapore. https://doi.org/10.1007/978-981-16-0843-8_5

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