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Characterization of Yttrium-Doped NiAl Fabricated at Different Substrate Temperatures Using EBPVD for Bond Coat in Thermal Barrier Coatings

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Intelligent Computing in Control and Communication

Part of the book series: Lecture Notes in Electrical Engineering ((LNEE,volume 702))

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Abstract

A film has been developed by electron beam physical vapor deposition (EBPVD) method on Inconel 625 substrate with substrate temperature of 873 K for bond coat in thermal barrier application. For this coating, a composition of Ni-49.8Al-0.2Y material formed into a pellet which is prepared by using a hydraulic press. The structural information, roughness, and morphology of coating have been characterized by using X-ray diffraction (XRD), atomic force microscopy (AFM), and field emission scanning electron microscopy (FESEM), respectively. The obtained results show that the crystallinity size is 29.43 nm, the average roughness is 88.14 nm in 2D and 3D topography, and the film is coated uniformly.

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Acknowledgements

The authors thankfully acknowledge the financial support from TEQIP-II through Ministry of Human Resource Development, Government of India, and greatly appreciated Andhra University College of Engineering (A), Andhra University, Visakhapatnam, Andhra Pradesh, India.

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Correspondence to Hemalatha Kandi .

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Kandi, H., Koona, R., Raju, G.M.J. (2021). Characterization of Yttrium-Doped NiAl Fabricated at Different Substrate Temperatures Using EBPVD for Bond Coat in Thermal Barrier Coatings. In: Sekhar, G.C., Behera, H.S., Nayak, J., Naik, B., Pelusi, D. (eds) Intelligent Computing in Control and Communication. Lecture Notes in Electrical Engineering, vol 702. Springer, Singapore. https://doi.org/10.1007/978-981-15-8439-8_43

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  • DOI: https://doi.org/10.1007/978-981-15-8439-8_43

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  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-15-8438-1

  • Online ISBN: 978-981-15-8439-8

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