Abstract
Climate changes have contributed to the growing importance of monitoring of the climate. A continuous monitoring of the environmental parameter is important to assess the value of the atmosphere. The IoT technology had taken revolution to any area of human life, making it digital and insightful. IoT is a collection of things that make up a network for self-configuration. Since the IoT is the most advanced technology, the collection of data from the sensor system plays a key role. This paper presents a Arduino UNO Wi-Fi module (ESP8266) which helps processing and transfers sensed information to the thing speak cloud, usually comprised of various sensors such as temperature, humidity and moisture, etc. Then, the obtained parameters are stored on the cloud server. A cloud computing system tracks environmental changes as a repository. Things talk will provide a function for a public channel, which is measured and calculated by the general public. A free access to measurement parameters is provided with an Android framework. This paper is aimed at proposing a new smart IoT based farming that supports farmers in obtaining live data (temperature, soil humidity) for successful environmental monitoring so that they can make smart farming and increase overall production and value of their products. The Novel Intelligent IoT Farming is embedded with Arduino Technology and the breadboard can be obtained from Thingsspeak.com with different sensor modules and live data feeds. A supporting, open API platform for IoT’s Thingspeak’s internet services is a host for a range of sensor systems that manage sensitive information at cloud level and incorporated a special feature of transferring sensed data to MATLAB R2019a. A Channel ID and API key assigned through the services can be used to monitor data quality at specific intervals.
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Penchalaiah, N., Nelson Emmanuel, J., Suraj Kamal, S., Lakshmi Narayana, C.V. (2021). IoT Based Smart Farming Using Thingspeak and MATLAB. In: Kumar, A., Mozar, S. (eds) ICCCE 2020. Lecture Notes in Electrical Engineering, vol 698. Springer, Singapore. https://doi.org/10.1007/978-981-15-7961-5_117
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