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Introduction to 3D Microelectronic Packaging

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3D Microelectronic Packaging

Part of the book series: Springer Series in Advanced Microelectronics ((MICROELECTR.,volume 64))

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Abstract

Advanced 3D microelectronic packaging technology has been employed to meet portable electronics and heterogeneous integration roadmap demands of ultra-thin, ultra-light, and high performance with low power consumption. It also opens up a new dimension for the semiconductor industry to maintain Moore’s law with a much lower cost. Motivations as well as various architectures of 3D packaging are illustrated. Challenges in 3D packaging, including fabrication, assembly, cost, design, modeling, thermal management, material, substrate, quality, reliability, and failure analysis, are reviewed with brief introduction to the chapters addressing these challenges.

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Acknowledgements

The editors would like to thank John Elmer from Lawrence Livermore National Laboratory for his critical review of this chapter.

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Authors and Affiliations

  1. Intel Corporation, Chandler, AZ, USA

    Yan Li & Deepak Goyal

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  1. Yan Li
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  2. Deepak Goyal
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Correspondence to Yan Li .

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Editors and Affiliations

  1. Intel Corporation, Chandler, AZ, USA

    Yan Li

  2. Intel Corporation, Chandler, AZ, USA

    Deepak Goyal

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Li, Y., Goyal, D. (2021). Introduction to 3D Microelectronic Packaging. In: Li, Y., Goyal, D. (eds) 3D Microelectronic Packaging. Springer Series in Advanced Microelectronics, vol 64. Springer, Singapore. https://doi.org/10.1007/978-981-15-7090-2_1

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  • DOI: https://doi.org/10.1007/978-981-15-7090-2_1

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  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-15-7089-6

  • Online ISBN: 978-981-15-7090-2

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