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A Planar Slotted RCS Based UWB RFID Tag on a PCB and a Flexible Substrate for Packaging Application

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Embracing Industry 4.0

Abstract

The passive chipless ultra wide band RFID tags are at the forefront of the research to replace the existing barcode technology. The attributes of the RFID system out-run various problems associated with the barcode system such as line of sight, wear and tear, tampering and etc. The chipless RFID tag in ultra wide band contains no chip that inherently makes it cheaper compared to chipped tags. However, due to their dimensions, sometime in the packaging industry, it exceeds the size of the package and also it comes with inadequate bit density. In addition, the fabricated tag is mostly designed on printed circuit boards that takes away the raping ability on the surface of the product. The tags on flexible substrates can be a good solution for this problem. In this paper, the radar cross-section response of a new planar Dual L-Slotted ultra wide band RFID tag has been studied and investigated on a printed circuit board and a flexible substrate. The tag contains 16 bits within the compact size of 15.2 × 7.2 mm2, having a bit density of 14.62 bit/cm2. The tag has been realized on Taconic TLX-8 as the rigid printed circuit board and a flexible substrate, Kapton®HN. For both cases the code “1111111111111111” has been successfully extracted. Both are suitable for RFID applications whereby the tag realized on the flexible substrate has the potentiality to use in the packaging industry and also in sensing applications.

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Acknowledgements

This work has been sponsored by the Research & Innovation Management Center (CRIM), Universiti Teknikal Malaysia Melaka (UTeM).

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Correspondence to A. K. M. Zakir Hossain .

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Zakir Hossain, A.K.M., Abidin Bin Abd Aziz, M.Z., Khang, A.W.Y., Indra, W.A. (2020). A Planar Slotted RCS Based UWB RFID Tag on a PCB and a Flexible Substrate for Packaging Application. In: Mohd Razman, M., Mat Jizat, J., Mat Yahya, N., Myung, H., Zainal Abidin, A., Abdul Karim, M. (eds) Embracing Industry 4.0. Lecture Notes in Electrical Engineering, vol 678. Springer, Singapore. https://doi.org/10.1007/978-981-15-6025-5_7

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