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Computational Investigation on the Thermal Characteristics of Heat Pipe Using Nanofluids

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Advances in Intelligent Manufacturing

Abstract

The enhancement of heat transfer rate is an essential requirement for the desirable operating conditions in various fields, such as electronic cooling, nuclear reactors cooling and solar collectors. To achieve such conditions, devices such as heat pipes are increasingly drawing attention due to its ability to dissipate heat and heat management ability along with small aspect ratio. Hence, in this paper a comprehensive model of heat pipe is built in order to capture the two-phase phenomenon and thermal characteristics, along with flow visualization. The volume of fluid (VOF) model present in the FLUENT module of the computational package ANSYS is utilized in the present work, which successfully captures the evaporation–condensation phenomena, to account for two-phase flow dynamics. Moreover, to model nanofluid single-phase approach is adapted for various nanoparticles, such as Al2O3, CuO2, TiO2 and SiC and correlations available in the literature are used to estimate the effective thermophysical properties. The obtained results confirm that the utilization of nanofluids in devices such as heat pipes enhances the thermal characteristics of heat pipe, which further indicates the enhancement of heat dissipation.

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Correspondence to Raja Sekhar Dondapati .

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Sandhu, R.S., Agarwal, R., Dondapati, R.S. (2020). Computational Investigation on the Thermal Characteristics of Heat Pipe Using Nanofluids. In: Krolczyk, G., Prakash, C., Singh, S., Davim, J. (eds) Advances in Intelligent Manufacturing. Lecture Notes in Mechanical Engineering. Springer, Singapore. https://doi.org/10.1007/978-981-15-4565-8_15

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  • DOI: https://doi.org/10.1007/978-981-15-4565-8_15

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  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-15-4564-1

  • Online ISBN: 978-981-15-4565-8

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